Failure analysis system

A failure analysis and failure testing technology, which is applied in electronic circuit testing and other fields, can solve problems such as frequent movement of the testing machine and affect the performance of the testing machine, and achieve the effect of improving efficiency

Inactive Publication Date: 2014-09-17
WUHAN XINXIN SEMICON MFG CO LTD
View PDF9 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of the above existing problems, the present invention discloses an analysis system to overcome the need to move the test machine to make it close to the analysis machine in the prior art where the testing machine is used to perform cyclic dynamic analysis on the chip to be tested, and after the analysis is completed, the The testing machine needs to be returned to its original position, resulting in frequent movement of the testing machine, thereby affecting the performance of the testing machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Failure analysis system
  • Failure analysis system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0032] Single-chip microcomputer is a kind of integrated circuit chip, which adopts VLSI technology to combine central processing unit (CPU), random access memory (RAM), read-only memory (ROM), various I / O ports and interrupt system with data processing capability. , Timer / counter and other functions are integrated into a small but complete microcomputer system formed on a silicon chip. It can be used as a miniature testing machine on the failure analysis machine, cooperate with the probe card or chip socket to realize the cycle test of the chip, and perform failure analysis during the cycle test.

[0033] Based on the fact that the single-chip microcomputer can be used as a miniature testing machine on the failure analysis machine, the present invention provides a failure analysis system, which...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a failure analysis system, and relates to the technical field of integrated circuit failure analysis. According to the failure analysis system, a testing process and testing conditions are written in a single-chip microcomputer, and then the single-chip microcomputer is used for controlling and realizing dynamic hotspot analysis of a chip, wherein the dynamic hotspot analysis process comprises various loop tests including a power source short circuit test, various electric leakage tests, a functional test and the like. In this way, a testing machine does not need to be moved frequently, and the performance of the testing machine will not be affected.

Description

technical field [0001] The invention relates to the technical field of failure analysis of integrated circuits, in particular to a failure analysis system. Background technique [0002] In the failure analysis process of integrated circuit chips, the location of the failure point is the first and most important step. The cell electrical analysis of the memory circuit, circuit layout, embedded test tools, photo emission (Photo Emission), and hot spot analysis (Hotspot) of laser-induced resistance changes can all provide assistance for failure location. For example, for the hotspot analysis of optical emission, there are generally two ways to generate optical emission according to different failure types and the complexity of the chip: one is short-circuiting the chip power supply (Power Short) and static power consumption (Istandby High), you can directly pressurize the power supply terminal (VCC) for light emission hotspot analysis; the other is that all chips fail or there...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 张顺勇周第廷高慧敏
Owner WUHAN XINXIN SEMICON MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap