The invention discloses a TEM-imitated
copper mesh type thermal and
electrical analysis chip and a manufacturing method thereof.The
chip comprises a
silicon substrate and insulating
dielectric layers deposited on the upper surface and the lower surface of the
silicon substrate, the shape and the size of the
silicon substrate are matched with those of a TEM
copper mesh, and hollowed-out areas are arranged on the silicon substrate and the insulating
dielectric layers on the lower surface in a penetrating mode to serve as observation windows; a circuit module is deposited on the surface of the upper surface insulating
dielectric layer above the hollow area, the circuit module comprises two groups of heating coils, two groups of electrical measuring electrodes and a temperature measuring
electrode, the two groups of electrical measuring electrodes are comb-shaped and are arranged between the two groups of heating coils up and down, the temperature measuring
electrode is arranged on the outermost side of one group of electrical measuring electrodes, and the temperature measuring
electrode is arranged on the outer side of the other group of electrical measuring electrodes. The circuit module is connected with an external measuring circuit. The
chip provided by the invention not only adapts to morphology characterization of a TEM conventional sample rod, but also adapts to a special sample rod, can be used for synchronously performing heating and electrical property measurement while observing a sample, and is beneficial to in-situ research on
nucleation growth,
structural evolution and corresponding
physical property change of a material in the TEM.