Method for detecting inner circuits in PCBs (printed circuit boards) by software GNENESIS

Abstract

The invention relates to a method for detecting inner circuits in PCBs (printed circuit boards) by software GENESIS. The method includes opening a backup drawing in the software GENESIS, closing attributes of other circuit layers of the drawing, and reversing attributes of an inner backup layer and a pore layer; subtracting a line width value of an inner circuit of a positive plate by a minimum line width required and allowed by process, adding minimum interval required and allowed by the process to spacing of the inner circuit of a negative plate, and performing electrical analysis of the inner layer; and locating independent thin lines unsatisfactory to the process according to open circuit contacts in reports of the inner layer electrical analysis. Existence of the thin lines unsatisfactory to the process in the inner circuits of the circuit boards can be judged accurately and quickly by the method, correction is made timely before production, defectiveness and scrappage of formed products are avoided, and cost is saved for manufactures effectively.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for detecting whether the design of the inner layer circuit of a PCB board meets the requirements of the manufacturing process by using GENESIS software. Background technique [0002] When designing and making inner layer materials in PCB drawing, there are often many small lines. These lines have independent electrical properties. If the design does not give enough width (when the inner layer copper thickness is 1 OZ, the lines generally need to be more than 5MIL), etch. It is easy to etch off the copper bridge, causing the inner layer of the board to be disconnected, and eventually lead to scrap or serious defect of the product. PCB manufacturers usually use the following two methods to detect such problems: A: check with the naked eye, but it is easy to miss, and cannot be absolutely reliable; B: directly use the signal layer checks (circuit layer analysis) ...

AI Technical Summary

Problems solved by technology

[0002]When designing and making inner layer materials in PCB drawing, there are often many small lines, which have independent electrical properties. If the design does not give enough width (inner When the copper layer thickness is 1 OZ, the line generally needs to be more than 5MIL), and the copper bridge is easily etched off during etching, causing the circuit break in the inner layer of the board, which eventually leads to product scrap or serious defect

PCB manufacturers usually use the following two methods to detect such problems: A: check with the naked eye, but it is easy to miss, and cannot be absolutely reliable; B: directly use the signal layer checks (circuit layer analysis) function check of the design software , but the analysis report generated by the design software has too many results, and it is impossible to accurately distinguish the real small copper bridge (line) with independent electrical properties