Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof
A technology of light-emitting diodes and packaging structures, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc. It can solve the problems of increasing costs and the lack of elasticity of the white frame, and achieve the effect of increasing luminous efficiency
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[0067] see figure 1 As shown, the first embodiment of the present invention provides a method for manufacturing a light-emitting diode packaging structure with a molded and filled convex lens, which includes: first, providing a substrate unit, which has a substrate body and a substrate disposed on the upper surface of the substrate body The crystal placement area; then, firstly, a plurality of light-emitting diode crystal grains are electrically arranged on the crystal placement area of the substrate unit; then, the liquid glue is coated on the upper surface of the substrate body; and then the liquid glue is cured material to form a wrap-around reflective colloid, and the wrap-around reflective colloid surrounds the light-emitting diode dies disposed on the crystal placement area to form a colloid-limited space above the substrate body; slurry to clean the inner surface of the surrounding reflective colloid, so that the inner surface of the surrounding reflective colloid fo...
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