Substrate structure applied to flexible electronic component and manufacture method thereof
A technology for flexible substrates and electronic components, which is used in electrical components, semiconductor/solid-state device manufacturing, electrical solid-state devices, etc.
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Embodiment 1
[0040] Production of epoxy adhesive
[0041] First, add and mix 185 grams of EPON 828 (bisphenol A epoxy resin, epoxy equivalent of 185-210, Shell Chemical product) and 79.99 grams of acrylic acid (Acrylicacid, molecular weight 72.06, TCI product) into a 1 liter reaction flask. , 0.34 grams of thermal inhibitor (2,2′-methylenebis(4-methyl-6-tert-butylphenol) (2,2′-methylenebis(4-methyl-6-tert-butylphenol)) ), SHOWA product) and 3.93 grams of catalyst (Triphenyl phosphine (triphenyl phosphine), Lancaster product). After that, the reaction flask was put into the oil bath, the stirring speed was 200 rpm, the reaction temperature was 105°C±5°C, the condenser temperature was 9°C, and the total reaction time was 5-6 hours, thereby preparing low molecular weight polymers.
[0042] Next, mix the above 40 grams of low molecular weight polymer, 60 grams of epoxy resin ECN-1299 (ortho-cresol novolac epoxy resin, epoxy equivalent of 217 to 244, Ciba Geigy product) and 142.8 grams of propylene...
Embodiment 2
[0044] Polyethylene naphthalate (PEN) / parylene (parylene) / epoxy / glass substrate structure production and film release test
[0045] First, a 8cm×8cm parylene (300nm) is plated on a 10cm×10cm PEN substrate. After that, a 100 μm epoxy resin adhesive layer was coated on a 10 cm×10 cm glass. Next, pre-bake at 80°C for 20 minutes, and bond the parylene-plated PEN substrate to the glass coated with an epoxy resin adhesive layer with a press machine. After that, put it in an oven and hard-bake (harden the film) at 150°C for 60 minutes to complete the production of the polyethylene naphthalate (PEN) / parylene / epoxy / glass substrate structure of this embodiment.
[0046] Film release test: Next, cut with a blade at a position of 7.5cm×7.5cm. This part can easily separate the PEN substrate from the glass, while the other parts adhere well to the glass and will not separate from the glass. The results are shown in Table 1. Shown.
Embodiment 3
[0048] Fabrication of polyethylene naphthalate (PEN) / parylene / epoxy resin / glass substrate structure and film release test
[0049] First, a 8cm×8cm parylene (300nm) is plated on a 10cm×10cm PEN substrate. After that, a 100μm epoxy adhesive layer was coated on the parylene-plated PEN substrate. Then, pre-baked at 80°C for 20 minutes, and glued the PEN substrate coated with epoxy resin adhesive layer and coated with parylene to the glass with a press machine. After that, it was put into an oven and hard-baked at 150° C. for 60 minutes to complete the production of the polyethylene naphthalate (PEN) / parylene / epoxy resin / glass substrate structure of this embodiment.
[0050] Film release test: Next, cut with a blade at a position of 7.5cm×7.5cm. This part can easily separate the PEN substrate from the glass, while the other parts adhere well to the glass and will not separate from the glass. The results are shown in Table 1. Shown.
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