Metal plate polishing device

Abstract

The invention discloses a metal plate polishing device. The device is characterized by comprising a base frame, a motor, a bearing mechanism and a transmission mechanism, wherein a polishing table face for arranging a metal plate is arranged on the upper end face of the base frame; the motor is arranged on the base frame and can rotate clockwise and anticlockwise; the bearing mechanism can be arranged on the polishing table face in a way of moving back and forth; sanding paper is detachably arranged on the bottom face; and the transmission mechanism is provided with a power input end connected with the motor and a power output end connected with the bearing mechanism. Compared with the prior art, the metal plate polishing device has the advantages that: the clockwise and anticlockwise rotation of the motor is converted into the back and forth movement of the bearing mechanism, so that the sanding paper on the bearing mechanism polishes the metal plate; the structure is simple; the automation degree is high; the polishing efficiency is improved; the whole polishing operation does not need manual operation substantially, so that the labor intensity is greatly reduced and human factors are reduced; and the uniformity and quality stability of the polished product are obviously better than those of the product polished by manual operation.

Description

technical field [0001] The invention relates to a grinding device, in particular to a grinding device applied to metal plates. Background technique [0002] Metal plates are often used in laboratories and processing plants, and the surface of the plates needs to be polished before use. For example, in the adhesive tape industry, stainless steel with a length of 150mm and a width of 70mm is used when the adhesive force of the tape needs to be tested. Board, when testing, paste the cut tape strips on the surface of the polished board, roll and place it for a certain period of time to pull the adhesive force of the tape. In this process, if the surface of the plate is not polished smoothly, it will lead to abnormal adhesion data and cause some interference to the test results. [0003] At present, the grinding of this type of board is generally done manually. Specifically, two thin boards are fixed on the table to fix the board, and then sandpaper is installed on the surface o...

AI Technical Summary

Problems solved by technology

[0007] But it has the following deficiencies: First, only one plate can be polished at a time, and the plate and sandpaper are frequently replaced, which is incapable of working with a large number of plates. Secondly, the contact pressure between the plate and sandpaper is provided by magnets, but due to different There is a slight deviation in the thickness of the plates, and the distance between the magnet and the platen has a great influence on the suction force between the magnet and the platen, which results in a great difference in the pressure on the thick plate and the thin plate , that is, the pressure on the thick plate is small, and the pressure on the thin plate is large, resulting in a small grinding force for the thick plate and a large grinding force for the thin plate, which affects the stability of the final test data; again, the inlaid at both ends It is difficult for magnets to ensure the consistency of magnetism, which results in a large force on one end and a small force on the other end, which has a great impact on the polishing effect of the board surface; finally, there are certain difficulties in cleaning the work surface and the board surface, and cleaning is often not clean. It will have a certain impact on the operation of subsequent personnel or the entire grinding plate device, and at the same time, the labor intensity of the operator will be increased due to the cleaning work

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