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Jointing equipment and method of tape membrane

A bonding method and film material technology, applied in chemical instruments and methods, lamination devices, electrical components, etc., can solve problems affecting product yield, increase material cost, lamination process failure, etc., to improve product yield, The effect of reducing material cost and saving bonding time

Inactive Publication Date: 2011-05-04
SONGYANG ELECTRONICS MATERIAL KUSN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the above-mentioned method is difficult to operate, because this method is to cut off the overlapping part of the almost exhausted film material 100 and the newly replenished film material 102, so as to keep an appropriate distance between the two film materials 100 and 102; After laminating two pieces of thermoplastic polyimide 104a, 104 at the junction of the two ends of the two film materials 100, 102, the copper sheet 106 is used to join the two film materials 100, 102, so the copper sheet 106 is used to join the film material 100 The operation of 102 has two contact points, respectively bonding the film materials 100 and 102. If the film materials 100 and 102 fail to maintain a proper distance or even overlap, the copper sheet 106 will be bonded on the same film material, resulting in failure. In addition, the relative positions of the copper sheet 106 and the film materials 100 and 102 must be aligned, and the positions between the film materials 100 and 102 must also be aligned. Therefore, there are requirements for alignment between these three materials. There is a problem of misalignment between the film and the film or between the film and the film. Once any two are not aligned accurately, it will lead to the failure of the subsequent lamination process, which will affect the product yield. In addition, due to The above method uses a copper sheet and two sheets of thermoplastic polyimide, so not only will the cost of materials be greatly increased, but also the operation time it consumes is quite long, and the operation convenience is not high

Method used

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  • Jointing equipment and method of tape membrane
  • Jointing equipment and method of tape membrane
  • Jointing equipment and method of tape membrane

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Embodiment

[0026] Embodiment: A bonding device for tape-and-roll film materials, including a carrier table 202, a hot-pressing device 204, and a cutting device 206, wherein:

[0027] The carrying platform 202 is used to carry the second film material 216, and make the first film material 208 be located on the second film material 216;

[0028] The hot pressing device 204 is arranged above the carrying platform 202 and above the first film material 208, and is used for hot pressing the first film material 208 and the second film material 216;

[0029] The cutting device 206 can be a separate device and can also be arranged on the carrier table 202, and it is arranged between the hot pressing device 204 and the first film material supply wheel 203, and it is used for cutting after the hot pressing process is carried out. The first film material 208 is cut, and then the bonding of the first film material 208 and the second film material 216 is completed.

[0030] It also includes a thermop...

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Abstract

The invention discloses jointing equipment and method of a taper membrane. The jointing equipment of the tape membrane comprises a bearing platform used for bearing a second membrane and enabling the first membrane to be positioned on the second membrane, a thermal pressing device arranged on the bearing platform and used for thermally pressing the first membrane and the second membrane, and a cutting device arranged between the thermal pressing device and a supply wheel of the first membrane and used for cutting the first membrane. The jointing method of the tape mechanism comprises the following steps of: jointing the first membrane on the second membrane; thermally pressing the first membrane and the second membrane; and cutting the first membrane to complete the jointing of the first membrane and the second membrane. The invention avoids the consumption of a large quantity of copper sheets and effectively reduces the material cost; meanwhile, the method provided by the invention effectively improves the alignment rate of the jointing membranes by using a one-point jointing mode, improves the product yield, and reduces the membrane waste. The jointing time can be saved by applying the method provided by the invention.

Description

technical field [0001] The invention relates to a production equipment and method of a flexible circuit board, in particular to a bonding equipment and method for tape-and-roll film materials. Background technique [0002] Due to its good flexibility, flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. As consumer electronics products gradually become thinner and smaller The trend of flexible printed circuit boards is also moving towards the use of thinner polyimide film copper foil laminates. [0003] The well-known manufacturing method of flexible printed circuit boards is mainly to paste copper foil on the surface of the polyimide film layer, and then form a polyimide film copper foil laminate by hot rolling. In the manufacturing process of imide film copper foil, it must go through a high-temperature oven (the temperature is higher than 350 ℃) f...

Claims

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Application Information

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IPC IPC(8): H05K3/00B32B37/06B32B37/10
Inventor 张家煌
Owner SONGYANG ELECTRONICS MATERIAL KUSN