Method for making rigid/flexible combined printed circuit board
A printed circuit board, rigid-flex combination technology, applied in the direction of printed circuit manufacturing, printed circuit, assembly of printed circuits with electrical components, etc. problems such as low melting temperature, to achieve the effect of good reliability and high yield
Active Publication Date: 2013-05-15
SHENZHEN FASTPRINT CIRCUIT TECH
View PDF5 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In the prior art, pure glue (a modified epoxy adhesive with a glass transition temperature below 100°C) is mostly used for the production of rigid-flex printed circuit boards with a thickness of more than 70 μm in the inner layer. The glass transition temperature of the glue is low, so it has a great influence on the reliability of the finished rigid-flex printed circuit board
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0021] Embodiments of the present invention are described in detail below in conjunction with accompanying drawings:
[0022] Such as image 3 As shown, the preferred embodiment of the manufacturing method of rigid-flexible printed circuit board of the present invention adopts 6-layer flexible board 1 and 4-layer rigid board 2, wherein, the thickness of rigid board 2 is at least 0.1mm, flexible board 1 and rigid board The thickness of the inner circuit of board 2 is 70 μm, the thickness of the flexible layer is 25 μm, and the non-flowing prepreg with a thickness of 75 μm is used for two times of lamination. The manufacturing method of the rigid-flexible printed circuit board includes: pre-processing the rigid board and the flexible board respectively; performing the first pressing and filling of the rigid board and the flexible board respectively; A rigid board and at least one flexible board are pressed together for the second time; drill through holes on the circuit board w...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a method for making a rigid / flexible combined printed circuit board, which comprises the following steps: respectively preprocessing a rigid board and a flexible board; respectively carrying out first laminating and glue filling on the rigid board and the flexible board; carrying out second laminating on at least one rigid board and at least one flexible board which are subject to first laminating and glue filling; drilling through holes in the circuit board where the rigid board and the flexible board need a connecting circuit; carrying out plasma treatment on the through holes; plating copper in the through holes; making and inspecting circuit patterns of the rigid board and the flexible board; making an outer solder mask layer outside the circuit of the rigid board and the flexible board; and milling the flexible part of the rigid board and the flexible board. By using the invention, a rigid / flexible combined printed circuit board of which the inner copper layer is at least 70 mu m thick can be made. By carrying out laminating and glue filling on the rigid board and the flexible board twice with stagnant prepregs, the finished rigid / flexible combined printed circuit board has the advantages of high reliability and high yield.
Description
technical field [0001] The invention relates to a method for manufacturing a rigid-flexible printed circuit board, in particular to a method for manufacturing a rigid-flexible printed circuit board with an inner layer copper thickness of at least 70 μm. Background technique [0002] Rigid-flex printed circuit boards are electronic components that combine rigid boards and flexible boards into one product. It has been developed for more than 30 years. In the early days, rigid-flex printed circuit boards were mostly used in military, medical and industrial equipment and other fields. In recent years, with the rapid development of requirements for mobile communications and consumer electronics (digital cameras, notebooks, liquid crystal displays), the demand for rigid-flex printed circuit boards has increased sharply. The advantages of rigid-flex printed circuit boards are: avoiding connectors, no wires and reducing assembly process steps, smaller mass, good bending ability and...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/36
Inventor 李志东陈蓓刘湘龙
Owner SHENZHEN FASTPRINT CIRCUIT TECH