Wafer replacing device used in chemical mechanical polishing equipment

Abstract

The invention relates to a wafer replacing device used in chemical mechanical polishing equipment and belongs to the technical field of chemical mechanical polishing equipment. The wafer replacing device comprises a lifting rack, the upper and the lower parts of the lifting rack are connected through a hollow cavity in a penetration manner, and a first air cylinder controlling the lifting of the lifting rack and a linear bearing are mounted at the lower part of the lifting rack; a guide shaft penetrates through the linear bearing; the upper part of the lifting rack is connected with a basin-shaped para-position ring through a spring, a second air cylinder controlling the lifting of a wafer support is mounted on the para-position ring, and an air cylinder rod of the second air cylinder penetrates through the para-position ring and then is connected with the bottom of the wafer support; and the axes of the wafer support, the second air cylinder and the para-position ring coincide with each other and are parallel to the axis of the linear bearing. During the polishing process, the wafer replacing device can be matched with a peripheral mechanical hand to finish the delivering and the taking of the wafer and also can be matched with a polishing head to finish the loading and the unloading of the wafer; and in the integral process including loading, unloading, taking and delivering, the precise positioning of the wafer can be realized and the damage to the wafer can be prevented.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing (CMP) equipment, in particular to a wafer exchange device for chemical mechanical polishing equipment. Background technique [0002] Chemical mechanical polishing (CMP) is one of the key technologies in the field of semiconductor manufacturing. It is currently the only process technology that can fully planarize the entire silicon wafer. It is considered to be able to take into account the requirements of wafer surface roughness and surface planarization. The best way to not damage the surface. At present, 300mm wafer has gradually become the mainstream choice of semiconductor manufacturing industry. Higher integration and thinner line width have put forward new requirements for traditional CMP technology. [0003] The wafer exchange device is one of the important components of CMP equipment. It is mainly responsible for exchanging wafers with peripheral equipment and loadin...

AI Technical Summary

Problems solved by technology

[0004] The existing wafer loading device has different structures depending on the requirements of the system, but it is necessary to perform necessary position transfer and positioning of the wafer during the completion of the work process. Due to the existence of mechanical errors, the wafer cannot There will always be a certain deviation between the actual position and the theoretical position. The existing technology often ignores this point, which makes the wafer exchange, especially the loading failure, and even the wafer breakage, which seriously affects the follow-up operations.

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