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Method for sputtering EMI (Electromagnetic Interference) metal layer or appearance decorative coating film on plastic base material

A plastic base material and metal layer technology, applied in metal material coating process, sputtering plating, coating, etc., can solve the problems of complex process, difficult cleaning, manual cleaning, etc., and achieve simple process and equipment, saving The effect of human cost

Inactive Publication Date: 2011-05-11
SUNTEK PRECISION CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process uses sand abrasion to greatly increase the surface roughness of the plastic substrate. After sandblasting, it is necessary to use the function of water washing to remove the residual sand from the plastic substrate. There are several disadvantages in this process:( 1) The sand used in sandblasting will remain on the surface of the plastic substrate, which is difficult to clean; (2) Manual cleaning is required, which will generate a lot of cost; (3) When the plastic substrate is injection molded, it is originally dry, but the sandblasting process It must be washed with water, and then the plastic substrate must be dried, resulting in process complexity; (4) Due to the increase in surface roughness and surface area after sandblasting, the required metal materials need to be increased by two to three times. The price of raw materials continues to increase, which also increases the cost accordingly

Method used

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  • Method for sputtering EMI (Electromagnetic Interference) metal layer or appearance decorative coating film on plastic base material
  • Method for sputtering EMI (Electromagnetic Interference) metal layer or appearance decorative coating film on plastic base material
  • Method for sputtering EMI (Electromagnetic Interference) metal layer or appearance decorative coating film on plastic base material

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Embodiment Construction

[0023] In order to make the above-mentioned purpose, features and advantages of the present invention more comprehensible, preferred embodiments are given in detail and described in detail as follows in conjunction with the accompanying drawings.

[0024] When the plastic substrate is injected in the molding factory, in order to make the injection smooth and not easy to stick the film, some oil or release agent is often sprayed during the manufacturing process, and these substances often cause oil and dirt to remain on the plastic substrate. Therefore, when the EMI metal layer or the appearance decorative coating is sputtered on the plastic substrate, its adhesion will be reduced due to the residual oil or dirt. see figure 1 , is the flow chart of the sputtering method provided by the embodiments of the present invention, the sputtering EMI (electromagnatic interference) metal layer provided by the present invention or the method for decorative coating on plastic substrates, m...

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Abstract

The invention provides a method for sputtering an EMI (Electromagnetic Interference) metal layer or an appearance decorative coating film on a plastic base material, comprising the steps of: washing the plastic base material for a first preset time with a hydrophobic organic solvent so as to remove oil dirt on the surface of the plastic base material; washing the plastic base material for a second preset time with a hydrophilic organic solvent so as to remove the hydrophobic organic solvent; and sputtering the EMI metal layer or the appearance decorative coating film on the plastic base material.

Description

technical field [0001] The invention relates to a method for preparing an EMI (electromagnatic interference) metal layer or a decorative coating on a plastic shell, in particular to a method for improving the adhesion of the metal layer or the decorative coating to a plastic substrate by sputtering. Background technique [0002] Since the component shapes of engineering plastics can usually be integrally formed, unlike metals that require additional metal processing procedures, it provides higher design flexibility and productivity for various electronic devices, and has become the main material for electronic device casings. Plastic is an insulator, but electromagnetic interference waves can freely penetrate plastic without a shielding layer. When electronic devices, especially digital circuits, are in operation, the electromagnetic waves generated will interfere with the normal operation of other devices, so it is necessary to add anti-EMI metal shielding layer. In additi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/20C23C14/02
Inventor 洪崇喜王国政郑兆希
Owner SUNTEK PRECISION CORP