Pad layout method for surface adhered circuit board and surface adhered circuit board
A technology of surface adhesion and layout method, which is applied in the directions of printed circuit components, electrical digital data processing, electrical connection printed components, etc., can solve problems such as empty soldering of pin terminals, and achieve the effect of improving stability
Active Publication Date: 2013-01-16
深圳市中络电子有限公司
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Problems solved by technology
[0006] In view of the above problems, the present invention provides a pad layout method of a surface-mounted type circuit board and a surface-mounted type circuit board to improve the plastic body of the conventional electrical connector due to uneven heating. Bending deformation, so as to prevent the misalignment between the pin terminals of the electrical connector and the pads of the circuit board, resulting in problems such as empty soldering of the pin terminals or insufficient tin intake
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[0029] figure 1 It is a flow chart of the steps of an embodiment of the present invention, and Figure 2A to Figure 2F It is a schematic diagram of decomposition steps of an embodiment of the present invention.
[0030] Such as figure 1 shown, and please cooperate with Figure 2A and Figure 2B For reference together, in the pad layout method of the surface mount type circuit board disclosed in the present invention, in step 110, a circuit board 200 is first provided, and the thermal expansion of the circuit board 200 is obtained according to the manufacturing material selected for the circuit board 200 The coefficient CTEa, and a plurality of predetermined layout positions 211 are pre-designed on a surface of the circuit board 200 by, for example, a computer program calculation method. These predetermined layout positions 211 are the original design layout positions on the circuit board 200 , which belong to the setting of virtual positions, and the predetermined layout p...
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The invention relates to a pad layout method for a surface adhered circuit board and the surface adhered circuit board. The layout method comprises the following steps of: firstly, acquiring thermal expansion coefficients of the circuit board and a surface adhered element, wherein the circuit board is preset with a plurality of predetermined layout positions; then, determining a working temperature of bonding the surface adhered element to the circuit board, and measuring an environmental indoor temperature; determining a plurality of actual layout positions on the circuit board according to d=(CTEa-CTEb)*(Ts-Tr), wherein d is an offset distance between the actual layout positions and the predetermined layout positions; and finally, laying a plurality of pads on the actual layout positions so that the pads are formed on the circuit board.
Description
technical field [0001] The present invention relates to a pad layout method of a circuit board and its circuit board structure, in particular to a pad layout method of a surface-adhesive circuit board and a circuit board of the surface-adhesive type, so as to avoid surface-adhesive Components and circuit boards are bent and deformed. Background technique [0002] Plastic raw materials can be roughly divided into thermoplastics (Thermoplastic) and thermosetting plastics (Thermosetting). At present, the plastic materials used in the electrical connector industry are mostly thermoplastics, which are usually granular at room temperature. After heating to a certain temperature, they become molten. After cooling, they are injected and solidified. It will soften and become a molten state, and can be plasticized again. Therefore, thermoplastics can be repeatedly solidified and shaped by heating and melting. [0003] However, generally relatively elongated electrical connectors, s...
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IPC IPC(8): G06F17/50H05K1/11
Inventor 吴仲扬黄弘道
Owner 深圳市中络电子有限公司