Liquid-cooled-type cooling device
A cooling device and liquid cooling technology, applied in the direction of cooling/ventilation/heating transformation, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem of not being able to effectively increase the effective heat conduction area and cooling performance of the heat sink The effect is limited and other problems, to achieve the effect of increasing the heat conduction area and improving the cooling performance
Active Publication Date: 2011-05-11
RESONAC CORPORATION
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Problems solved by technology
Therefore, the effective heat conduction area of the heat sinks 40A and 40B cannot be effectively increased, and the effect of improving cooling performance is limited.
Method used
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[0030] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all drawings, the same code|symbol is attached|subjected to the same part and the same object, and repeated description is abbreviate|omitted.
[0031] In the instructions below, set the figure 2 Up and down, left and right are up and down, left and right, set image 3 The lower side is the front, and the upper side is the rear.
[0032] In addition, in the following description, the term "aluminum" includes aluminum alloys in addition to pure aluminum.
[0033] Figure 1 ~ Figure 3 Represent the overall structure of the liquid-cooled cooling device of the present invention, Figure 4 with Figure 5 Indicates the composition of its main parts. in addition, Figure 1 ~ Figure 3 A state in which a heating element including a semiconductor element is mounted on the liquid-cooled cooling device of the present invention is shown.
[0034]exist Figure...
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A liquid-cooled-type cooling device (1) includes a casing (2) having a cooling-liquid flow channel (15). Heating elements (H) are provided on an inner surface of a top wall (3) of the casing (2). Each fin (16A, 16B) has a wavy shape on a horizontal plane perpendicular to a fin height direction. In a left fin (16A) of two adjacent fins, lines of intersection between the horizontal plane and right side surfaces (22a) of two slant portions connecting two adjacent wave crest portions (19) and a wave trough portion (21) therebetween intersect each other at a first point located on a first straight line. In a right fin (16B), lines of intersection between the horizontal plane and left side surfaces of two slant portions connecting two adjacent wave trough portions and a wave crest portion therebetween intersect each other at a second point located on a second straight line. The first straight line (L1) is located on the right fin (16B) side of the second straight line (L2). The liquid-cooled-type cooling device (1) of the invention is adapted to semiconductor electric power conversion device of such as an automobile, and is adapted to cooling the heating elements of semiconductor component.
Description
technical field [0001] The present invention relates to a liquid-cooled type cooling device for cooling a heat generating body such as a semiconductor element, which is suitable for a semiconductor power conversion device such as a vehicle, for example. Background technique [0002] Conventionally, as such a liquid-cooled type cooling device, there is known a liquid-cooled type cooling device provided with a housing having a top wall, a bottom wall, and a peripheral wall and forming a cooling liquid inlet and a cooling liquid outlet. A cooling liquid flow path is provided at a position between the liquid inlet and the cooling liquid outlet, wherein the inner surface of the part of the wall facing the cooling liquid flow path where the heating element is installed on the outer surface of the top wall and the bottom wall of the housing, In the width direction of the cooling liquid flow path, a plurality of cooling fins protruding into the cooling liquid flow path and extending...
Claims
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IPC IPC(8): H01L23/473H01L23/367H05K7/20
CPCH01L23/3672H01L23/473H01L2924/0002H01L2924/00
Inventor 森昌吾伊藤贤松岛诚二栗林泰造
Owner RESONAC CORPORATION