Cultivation method for improving maturing rate and thousand seed weight of burdock
A cultivation method and a technology of seed setting rate, which are applied in the cultivation field of increasing the seed setting rate and thousand-grain weight of burdock seeds, can solve the problems of insufficient grain size and low seed setting rate of artificially planted burdock seeds, and achieve the goals of improved water and fertilizer management, good drainage, and guaranteed emergence rate Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0018] Embodiment 1: a kind of cultivation method that improves burdock seed setting rate and 1000-grain weight, it comprises following technical links:
[0019] 1) Site selection and preparation: select loam or sandy loam with sufficient sunlight, deep and fertile soil, good drainage, and a pH value of 6.7 to 7.0; carry out autumn plowing with a depth of 32 to 34 cm, and apply 3,500 kg of decomposed manure per mu To make base fertilizer, apply the fertilizer into the soil layer with a depth of 22 to 25 cm, and mix evenly;
[0020] 2) Timely sowing: Sowing in mid-to-late May, soaking the seeds in warm water at 32°C for 25 hours, sowing in holes on the well-built furrows, with a row spacing of 50 cm and a hole spacing of 16 cm, sowing 6 to 7 seeds per hole, covering with soil 3 to 4 cm;
[0021] 3) Field management: When the seedlings grow to 2 to 3 true leaves, firstly carry out thinning and fixed seedlings, leave 2 strong seedlings in each hole, carry out intertillage weedin...
Embodiment 2
[0024] Embodiment 2: a kind of cultivation method that improves burdock seed setting rate and 1000-grain weight, it comprises following technical link:
[0025] 1) Land selection and land preparation: select loam or sandy loam with sufficient sunlight, deep and fertile soil, good drainage, and a pH value of 6.8 to 7.2; carry out autumn plowing, with a depth of 38 to 40 cm, and apply 3,800 kg of decomposed manure per mu To make base fertilizer, apply the fertilizer into the soil layer with a depth of 25 to 30 cm, and mix evenly;
[0026] 2) Timely sowing: Sowing in mid-to-late May, soaking the seeds in warm water at 35°C for 26 hours, sowing in holes on the well-built furrows, row spacing 60 cm, hole spacing 17 cm, 6-7 seeds per hole, covering with soil 3 to 4 cm;
[0027] 3) Field management: When the seedlings grow to 2 to 3 true leaves, firstly carry out thinning and fixed seedlings, leaving 1 strong seedling in each hole, carry out intertillage weeding and pest control in ...
Embodiment 3
[0030] Embodiment 3: a kind of cultivation method that improves burdock seed setting rate and 1000-grain weight, it comprises following technical links:
[0031] 1) Land selection and preparation: select loam or sandy loam with sufficient sunlight, deep and fertile soil, good drainage, and a pH value of 7.0 to 7.4; carry out autumn plowing with a depth of 35 to 38 cm, and apply 3,200 kg of decomposed manure per mu To make base fertilizer, apply the fertilizer into the soil layer with a depth of 24 to 28 cm, and mix evenly;
[0032] 2) Timely sowing: Sowing in mid-to-late May, soaking the seeds in warm water at 38°C for 23 hours, sowing in holes on the well-built furrows, row spacing 55 cm, hole spacing 18 cm, 6-7 seeds per hole, covering with soil 3 to 4 cm;
[0033] 3) Field management: When the seedlings grow to 2 to 3 true leaves, firstly thin the seedlings and set the seedlings, leave 3 strong seedlings in each hole, carry out intertillage and weeding and pest control in ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com