Plasma processing device, plasma processing method, and mechanism for regulating temperature of dielectric window

A plasma and processing device technology, applied in the field of plasma processing device and temperature adjustment mechanism, can solve the problems of process gas decomposition, process gas excitation efficiency change, etc., and achieve the effect of uniform temperature distribution and good processing characteristics

Inactive Publication Date: 2011-05-25
TOKYO ELECTRON LTD
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  • Abstract
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Problems solved by technology

The overheating of the dielectric window causes a change in the excitation efficiency of the process gas or causes undesirable phenomena such as decomposition of the process gas.

Method used

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  • Plasma processing device, plasma processing method, and mechanism for regulating temperature of dielectric window
  • Plasma processing device, plasma processing method, and mechanism for regulating temperature of dielectric window
  • Plasma processing device, plasma processing method, and mechanism for regulating temperature of dielectric window

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Embodiment Construction

[0038] Hereinafter, a plasma processing apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same reference numerals are assigned to the same or corresponding parts in the drawings, and the description thereof will not be repeated.

[0039] like figure 1 As shown, a plasma processing apparatus 1 has a processing container (chamber) 2, an antenna 4, a waveguide 5, a cooling block 6, a substrate holding table 7, an exhaust port 8a, a vacuum pump 8b, a high-frequency power supply 9, a door 11, a temperature Sensor 16 , cover 17 , gas supply 18 .

[0040] The processing container 2 has a lower container 12 , a holding ring (upper plate) 15 , and a dielectric window (shower plate) 3 .

[0041] The processing container 2 is configured to be sealable. By sealing the processing container 2, the pressure inside the processing container 2 can be maintained at a predetermined value. Furthermore, by ...

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Abstract

Provided are a plasma processing device, a plasma processing method, and a mechanism for regulating the temperature of a dielectric window, which can achieve a better plasma processing characteristic by more precisely controlling the temperature of the dielectric window through which a microwave used for plasma processing is transmitted. A plasma processing device (1) is provided with a processing container (2), a dielectric window (shower plate) (3), an antenna (4), a waveguide (5), a cooling block (6), a substrate holding table (7), and a holding ring (upper plate) (15) attached to the top of the processing container (2). The peripheral edge of the dielectric window (3) is locked by the holding ring (15). The cooling block (6) provided with a cooling channel (6a) through which a heat medium can flow is provided on the antenna (4). A temperature sensor (16) is provided around the waveguide (5), and the temperature of the antenna (4) or the like is detected. A lamp heater (151) is provided in the holding ring (15). The dielectric window (3) is controlled to have a predetermined temperature distribution by a cooling means of the cooling block (6) and a heating means of the holding ring (15) which are controlled by a control means.

Description

technical field [0001] The present invention relates to a plasma processing device, a plasma processing method and a temperature adjustment mechanism for a dielectric window. Background technique [0002] Plasma processing for the purpose of depositing thin films, etching, and the like is widely performed in semiconductor manufacturing processes. In order to obtain high-performance and high-quality semiconductors, it is required to perform uniform plasma processing on the entire surface of a substrate to be processed in a space with high cleanliness. This requirement becomes stronger as the diameter of the substrate increases. [0003] Currently, excitation of a process gas by microwaves is widely used as a plasma generation method in plasma processing. Microwaves have the property of passing through dielectrics. The plasma processing apparatus is provided with a window formed of a dielectric material through which microwaves pass (hereinafter referred to as a dielectric ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/205H01L21/3065H05H1/46
CPCH01J37/32522H01J37/32192H01J37/32238
Inventor 西本伸也
Owner TOKYO ELECTRON LTD
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