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Laser-cutting method of GaAs-based LED (Light-Emitting Diode) chip

A LED chip and laser cutting technology, which is applied to laser welding equipment, electrical components, circuits, etc., can solve the problems of affecting chip production capacity, destroying the light-emitting area, and losing raw material areas, etc., to achieve increased chip brightness and low damage to the light-emitting area. The effect of productivity improvement

Inactive Publication Date: 2011-06-01
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using the traditional laser cutting process, the width of the scribing groove is generally between 15 μm and 30 μm, and a lot of raw material area will still be lost, and a certain area of ​​light-emitting area will be destroyed, which will directly affect the chip production capacity.

Method used

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  • Laser-cutting method of GaAs-based LED (Light-Emitting Diode) chip
  • Laser-cutting method of GaAs-based LED (Light-Emitting Diode) chip

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Embodiment Construction

[0012] The embodiment of the present invention uses the Newwave Research AS2112 laser scribing machine for laser cutting, and a modified optical path as shown in the accompanying drawing is set on the laser dicing machine. The modified optical path includes five full reflections of M1, M2, M3, M4 and M5. Mirror and four perspective mirrors P1, P2, P3 and P4, five total reflection mirrors are arranged between the laser and the laser head of the laser scribing machine in turn, and the three perspective mirrors P1, P2 and P3 are arranged side by side on the total reflection mirror Between M2 and M3, the perspective mirror P4 is located between the total reflection mirror M5 and the laser head. The scribing focal length is 0.521-0.543μm, the laser power is 1-1.2W, and the scribing speed is 60-70mm / s. The specific operation method is as follows:

[0013] 1. Paste the GaAs-based LED chip on a white film, with the P side of the chip facing the film and the N side facing up, and plac...

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Abstract

The invention provides a laser-cutting method of a GaAs-based LED (Light-Emitting Diode) chip. The method comprises the following steps of: laser cutting the N surface of a GaAs chip to form laser scratches; and then cracking the chip on the P surface of the GaAs chip along the laser scratches by using a chip cracking machine, wherein the depth of the formed laser scratches is 1 / 10-4 / 5 of the thickness of the chip. The invention has the advantages of combining a laser cutting method, changing a cutting way, laser cutting the GaAs-based LED chip by adopting back-scratching, maintaining a chip raw material region to the maximum extent, lowering the damage on the lighting area to the minimum and greatly improving the production capacity and the brightness of the chip.

Description

technical field [0001] The invention relates to a gallium arsenide (GaAs)-based light-emitting diode (LED) chip cutting process, belonging to the technical field of semiconductor chip cutting. Background technique [0002] The cutting process in the preparation process of GaAs-based LED chips is to divide the whole chip into single chips. At present, the cutting of GaAs-based LED chips mostly uses diamond tools for mechanical cutting. The production efficiency of mechanical cutting is low, and the blade wears quickly. During the cutting process, deionized water is required to be continuously sprayed on the grinding wheel and the chip, and the production cost is high. Moreover, the blade directly contacts the chip during mechanical cutting, and chipping is easy to occur on the side of the chip. And cracks, the product qualification rate is low. [0003] With the development of laser technology, laser cutting has gradually become practical. The process is to burn scratches on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/06B23K26/42H01L33/00B23K26/064B23K26/38
Inventor 赵霞焱徐现刚张秋霞黄少梅
Owner Shandong Huaguang Optoelectronics Co. Ltd.