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Mems microphone packaging and mems microphone module

A technology for microphones and readout devices, applied in microstructure devices, manufacturing microstructure devices, transducer shells/cabinets/supports, etc., can solve the problems affecting the frequency characteristics of the sensor, affecting the performance of the sensor, etc., and achieve a high signal-to-noise ratio. , the effect of small footprint

Active Publication Date: 2011-06-01
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, typically, a housing is placed around the sensor body, which in turn affects sensor performance, such as sensitivity, signal-to-noise ratio (SNR), or possibly frequency characteristics of the sensor

Method used

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  • Mems microphone packaging and mems microphone module
  • Mems microphone packaging and mems microphone module
  • Mems microphone packaging and mems microphone module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] figure 1 An embodiment of a method for producing a microphone module is shown. According to this method, the MEMS microphone structure 2 is arranged on the first surface 4 a of the first substrate 4 . The cover 6 is also arranged on the first surface 4a such that the cover 6 and the first surface 4a enclose the MEMS microphone structure 2 so that the MEMS microphone structure 2 can be protected from damage. However, it may be noted that the seal of the cover does not have to be airtight, so that, according to some embodiments, pressure may enter the volume enclosed by the cover 6 .

[0023] The readout means 8 for the MEMS microphone structure 6 are arranged on the first surface 10 a of the second substrate 10 . In order to associate the readout device 8 with the MEMS microphone structure 2, the first substrate and the second substrate are attached to each other such that they are attached with their second surfaces 4b and 10b, respectively. As is evident from the pr...

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PUM

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Abstract

The invention relates to an MEMS Microphone Packaging and MEMS Microphone Module. A method for producing a microphone module includes arranging a MEMS microphone structure on a first surface of a first substrate, the first substrate further including a second surface, which is opposite to the first surface. Furthermore, a cap is arranging on the first surface of the first substrate such that the cap and the first surface enclose the MEMS microphone structure. A readout device for the MEMS microphone structure is arranged on a first surface of a second substrate which further includes a second surface, which is opposite to the first surface. The second surface of the first substrate is attached to the second surface of the second substrate.

Description

technical field [0001] Embodiments of the present invention relate to efficient methods of fabricating microphone modules using MEMS microphones and to improved MEMS microphone modules. Background technique [0002] Acoustic sensor modules based on MEMS (micro-electromechanical structure) microphones need to be packaged to avoid damage to sensitive sensors. That is, typically, a housing is placed around the sensor body, which in turn affects the performance of the sensor, such as sensitivity, signal-to-noise ratio (SNR), or possibly frequency characteristics of the sensor. Therefore, in order to be able to provide improved MEMS microphone modules, there is a need for advantageous methods of fabricating MEMS microphone modules. Contents of the invention [0003] According to some embodiments of the invention, a MEMS microphone module is made by disposing a MEMS microphone on a first surface of a first substrate, the substrate also receiving a cover mounted on the first sur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R31/00H04R1/02B81C1/00H04R19/04H01L2224/48091H01L2924/10253B81B7/02H04R19/005H01L2924/1461H01L2924/00014H01L2924/00
Inventor A·德厄M·菲尔德纳M·武策尔
Owner INFINEON TECH AG