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Cooling method and cooling system of electronic device

A technology of electronic equipment and cooling system, which is applied to the structural components of electrical equipment, air conditioning systems, mechanical equipment, etc. It can solve the problems of reduced condensing pressure, ineffective heat control, unstable natural circulation of refrigerant, etc., and achieves suppression of evaporation pressure Changes, the effect of preventing condensation

Inactive Publication Date: 2011-06-01
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the evaporating temperature fluctuates, the evaporating pressure also fluctuates, so there is a problem that the natural circulation of the refrigerant becomes unstable.
[0018] (2) In addition, in the evaporative condenser of Patent Document 4, when the outside air temperature decreases, the condensation pressure at which the refrigerant gas is condensed by the heat exchange coil decreases.
However, when the outside air temperature drops, even if the air volume is reduced, the temperature of the outside air in contact with the heat exchange coil is low, so the condensation pressure drops.
In addition, although it is possible to reduce the amount of water sprayed from the sprinkler to the heat exchange coil, it is basically not effective in heat control when the outside air temperature is low.

Method used

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  • Cooling method and cooling system of electronic device
  • Cooling method and cooling system of electronic device
  • Cooling method and cooling system of electronic device

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Experimental program
Comparison scheme
Effect test

Embodiment approach A

[0068] In Embodiment A, even if the refrigerant flow rate of the evaporator in the cooling system of the refrigerant natural circulation method is valve-controlled, the natural circulation of the refrigerant can be kept stable, and condensation on the surface of the evaporator can be prevented. The cooling method and cooling system of electronic equipment will be described. In addition, as an electronic device, a server arranged in a server room will be described as an example.

no. 1 approach

[0070] figure 1 It is a conceptual diagram showing the overall configuration of the first embodiment of the cooling system 10 for electronic equipment.

[0071] The cooling system 10 shown in the figure is a system for locally cooling the vicinity of the servers 14 installed in the server rooms 12X and 12Y on the upper and lower floors. In addition, in the following description, the symbol X attached|subjected is the component related to the cooling system of the lower floor, and Y is the component related to the cooling system of the upper floor. In addition, in figure 1 In the figure, one server 14 is shown in each server room 12X, 12Y, but a plurality of servers 14 are actually arranged. In addition, the servers 14 are generally stored in layers by server racks (not shown), and thus are installed in the server rooms 12X and 12Y.

[0072] The server 14 is equipped with an air suction port 14A and an air exhaust port 14B, and is equipped with a fan 14C inside. By driving t...

no. 2 approach

[0096] figure 2 It is a conceptual diagram showing the overall configuration of the second embodiment of the cooling system 10 for electronic equipment, and is a case where a circulation duct type cooling tower is installed as a device for condensing refrigerant gas.

[0097] In addition, the same code|symbol is attached|subjected to the part common to 1st Embodiment, and description is abbreviate|omitted.

[0098] Such as figure 2 as well as image 3 As shown, a connection hole 30C is opened in the side surface of the cooling tower main body 30 on the side of the intake port 30A, and a part of the exhaust port 30B and the connection hole 30C are connected by a circulation duct 38 . Accordingly, since a part of the exhaust outside air Y whose temperature has been raised from the exhaust port 30B is circulated to the vicinity of the intake port 30A through the circulation duct 38 , the exhaust outside air Y and the intake outside air X are mixed. As a result, the outside a...

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PUM

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Abstract

A cooling method of an electronic device, the cooling method naturally circulating a cooling medium between an evaporator, which gasifies the cooling medium and cools heat-discharging air from the electronic device by heat exchange with the heat-discharging air, and a cooling tower or a condenser, which is disposed at a higher position than the evaporator and liquefies the gasified cooling medium, and subjecting a flow rate of the cooling-medium liquid supplied to the evaporator to valve control so that a temperature of the air obtained after the heat exchange and the cooling by the evaporator becomes a temperature suitable for an operating environment of the electronic device, wherein the improvement comprises that a condensation temperature or a condensation pressure of the cooling-medium gas in the cooling tower or the condenser is configured to be not varied even when the flow rate of the cooling-medium liquid supplied to the evaporator is subjected to the valve control.

Description

technical field [0001] The present invention relates to a cooling method and a cooling system for electronic equipment, and in particular to a method for partially cooling electronic equipment such as computers and servers arranged in a server room by making the refrigerant circulate naturally between the evaporator and the cooling tower (or condenser). A cooling method and a cooling system for cooled electronic equipment. Background technique [0002] In the server room, many electronic devices such as computers and servers are arranged intensively. Electronic equipment is generally installed in racks, that is, racks (casings) that are divided into functional units and accommodate electronic equipment are installed in racks, and a plurality of racks are arranged on the floor of a server room. [0003] These electronic devices require a certain temperature environment in order to operate normally, and if they become in a high temperature state, there is a possibility of cau...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F24F11/76
CPCF24F3/065F24F11/053F24F11/0012H05K7/20836F24F2011/0041F24F11/001H05K7/2079H05K7/20827H05K7/20245F24F11/30F24F2110/00F24F2110/10F24F2110/40F24F11/76
Inventor 头岛康博伊藤润一稻富泰彦杉浦匠下川良二仙田昌克大岛升
Owner HITACHI LTD