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Buffer with high heat conducting quantity

A buffer and thermal technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of no unified electrical interface, insufficient protection of electrical lines, unfavorable product standardization and modularization, etc., to achieve convenient connection, high integration, Simple structure and strong effect

Inactive Publication Date: 2013-07-10
江苏欣力光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, various structures and devices do not provide enough protection for electrical circuits in high-temperature working environments, and there is no unification of electrical interfaces between them, which is not conducive to product standardization and modularization, and hinders the rapid popularization of LED light sources.

Method used

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  • Buffer with high heat conducting quantity
  • Buffer with high heat conducting quantity
  • Buffer with high heat conducting quantity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: The main body of the buffer with high thermal conductivity is a conical base 1 . The seat body 1 is hollow, and its hollow part is an inverted tapered inner cavity 1-2. From the center of the bottom end of seat body 1, such as image 3 As shown, radially embedded insulator electrical terminals 1-3. The bottom surface of the electrical connection terminal 1-3 is flush with the bottom surface of the base body 1, the electrical connection terminal 1-3 has an internal interface at the lead-out part of the inner chamber 1-2, and the electrical connection terminal 1-3 has an external interface on the side of the base body 1. By providing standardized electrical terminals 1-3, standardize the electrical interface standard of the LED package. In addition, the electrical connection terminals 1-3 have good high-temperature insulation, which is sufficient to resist high heat during high-power LED operation, and protect the electrical connections inside the terminal...

Embodiment 2

[0029] Embodiment 2: The main body of the buffer with high thermal conductivity is a conical base 1 . The seat body 1 is hollow, and its hollow part is an inverted tapered inner cavity 1-2. The bracket carrying the LED is located in the inner cavity 1-2, and is in close contact with the wall of the inner cavity 1-2, and conducts heat through the cavity wall to the seat body 1 made of aluminum alloy, and the seat body 1 acts as a heat buffer. Experiments have shown that as long as the surfaces of the bracket and the inner cavity 1-2 are smooth enough, the best heat dissipation effect can be achieved without applying silicon grease. From the center of the bottom end of seat body 1, such as image 3 As shown, radially embedded insulator electrical terminals 1-3. The bottom surface of the electrical connection terminal 1-3 is flush with the bottom surface of the base body 1, the electrical connection terminal 1-3 has an internal interface at the lead-out part of the inner chambe...

Embodiment 3

[0030] Embodiment 3: The main body of the buffer with high thermal conductivity is a conical base 1 . The seat body 1 is hollow, and its hollow part is an inverted tapered inner cavity 1-2. The bracket carrying the LED is located in the inner cavity 1-2, and is in close contact with the wall of the inner cavity 1-2, and conducts heat through the cavity wall to the seat body 1 made of aluminum alloy, and the seat body 1 acts as a heat buffer. From the center of the bottom end of seat body 1, such as image 3 As shown, radially embedded insulator electrical terminals 1-3. The bottom surface of the electrical connection terminal 1-3 is flush with the bottom surface of the base body 1, the electrical connection terminal 1-3 has an internal interface at the lead-out part of the inner chamber 1-2, and the electrical connection terminal 1-3 has an external interface on the side of the base body 1. When the LED is working, the electrical circuit drawn from the bracket is connected t...

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Abstract

The invention relates to a buffer with high heat conducting quantity, which is designed aiming at an illumination LED (Light Emitting Diode) packaging structure. The buffer with high heat conducting quantity is a hollow metal base body with the upper surface being a concave surface, and the base body is provided with a wiring terminal. An inner cavity of the buffer with high heat conducting quantity can be tightly bonded with an LED-bearing metal support to absorb the heat of the metal support and reduce the working temperature of the packaging structure. The buffer with high heat conducting quantity is high in radiating efficiency, simple in structure and easy in processing, and provides excellent protection for the operation of electrical lines under high-temperature environments, in addition, a standardized design scheme for electrical interfaces of the LED packaging structure is provided.

Description

technical field [0001] The invention relates to a high heat conduction buffer, in particular to a high heat conduction buffer applied to an illumination-level light-emitting diode packaging structure. Background technique [0002] In recent years, the development of light-emitting diodes has attracted much attention. LED light sources have gradually penetrated into larger lighting markets, such as indoor and outdoor lighting and automotive light sources. With the expansion of the application range of light-emitting diode light sources, the power of light-emitting diode packaging structures continues to increase, and high-power light-emitting diodes and their packaging have become the focus of the photovoltaic industry. With the increase of light-emitting diode power, the high heat generation problem has brought a series of problems such as reduced LED life, shortened light decay period, and increased failure rate. For this reason, people have designed a variety of high-pow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/60
Inventor 牟小波陈旭
Owner 江苏欣力光电有限公司