Novel un-cooled infrared focal plane imaging system

An uncooled infrared imaging system technology, applied in the field of new uncooled infrared focal plane array imaging system, achieves the effect of reducing performance requirements and improving imaging performance

Inactive Publication Date: 2011-06-22
BEIJING INSTITUTE OF TECHNOLOGYGY
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Problems solved by technology

[0007] The purpose of the present invention is to improve the sensitivity of the optical readout uncooled infrared focal plane array imaging system, to provide a double optical path, which can effectively deduct and eliminate the light source power supply ripple, light source aging, ambient temperature and illuminance changes on the system. Influence, improve the stability and reliability technology of system work

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Embodiment Construction

[0017] Specific embodiments of the present invention will be described in detail below.

[0018] 1. System composition

[0019] The novel optical readout uncooled infrared focal plane imaging system of the present invention is composed of an infrared imaging optical path, an illumination optical path, a spectroscopic device, an optical readout optical path, a reference optical path, and an image acquisition and processing device, specifically as figure 2 Shown:

[0020] The infrared imaging optical path is composed of an infrared imaging lens group 1 and a focal plane array 7, and the infrared lens images the thermal image of an external target on the focal plane array 7, so that the pixel array of 7 produces regular changes;

[0021] The illumination optical path includes a light source 8 and a light source collimator lens group 2, and the illumination optical path provides visible, non-interfering, parallel illumination beams for the entire system;

[0022] The spectrosco...

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Abstract

The invention provides a novel un-cooled infrared focal plane array imaging system, which comprises infrared imaging light paths 1 and 7, illumination light paths 2 and 8, a light splitting device 3, an optical readout light path 4, a reference light path 5 and an image acquisition and processing system 6. The 1 images the hot image of an external scene on an infrared focal plane array 7, so that the array image element of the 7 is changed; the parallel light emitted from the 2 is split into two beams by the 3, wherein one beam enters the 1, is modulated by the 7 carrying external infrared hot image signals and then enters the 4, and the other beam directly enters the 5; and the light emitted from the 4 and the 5 simultaneously enters the 6, and the light is processed to output an infrared hot image. The system has the core that the 5 is increased; and when the image is processed, the infrared hot image output by the 4 can be corrected in real time by using the output signals of the 5 so as to eliminate the influence of light source and power supply ripples, light source ageing and environmental temperature and illumination changes on the imaging precision and the sensitivity of the system and improve the working stability and reliability of the system.

Description

technical field [0001] The invention relates to a novel uncooled infrared focal plane array imaging system, in particular to an uncooled infrared focal plane array imaging system with dual optical paths and optical readout. Background technique [0002] The traditional infrared thermal imaging system is a scanning thermal imaging system. Due to its complex process, high price, large volume and high power consumption, it is difficult to use it on a large scale. In recent years, the development of uncooled FPA infrared thermal imaging technology has greatly reduced the manufacturing cost, volume, weight, and power consumption of infrared thermal imaging systems, and has gradually realized productization in more and more fields. [0003] A new uncooled infrared imaging technology is the infrared focal plane array imaging system, which is characterized by using the focal plane array device FPA as the infrared image sensor. FPA is a device based on MEMS technology. It is compose...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/08G01J5/02
Inventor 赵跃进褚旭红董立泉刘小华于晓梅龚诚
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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