Method for cutting wafers

Abstract

The invention relates to a method beonging to the machining field, in particular to the method for cutting wafers. The method concretely comprises a blade adjusting technology and a sand mixing technology. Based on the blade adjusting technology, gaskets with corresponding thicknesses are selected according to the thicknesses requirements of different wafers, one gasket is put between each two blades, and then blade adjustment is began, and finally the effect that the value of thicknes difference on both sides of an integral cutting device ranges from 0.025 to 0.035mm is achieved, and the blades are in a straightening state. Based on the sand mixing technology, sand solution in different concentrations is configured according to the thickness requirements of the different wafers. During the cutting process, sand solution is removed at first before sands are added hourly, corresponding cutting oil is added, and the concentration of cutting fluid is kept accordant. The method for cutting the wafers improves the uniformity and the surface quality of the wafers.

Description

technical field [0001] The invention relates to a process method in the field of mechanical processing, in particular to a new process capable of improving the cutting quality of quartz wafers. Background technique [0002] Quartz crystal devices have excellent frequency selection and stabilization characteristics, and are the core components of frequency selection and control in electronic information technology. They are widely used in computers, household appliances, aerospace electronics, mobile communications, satellites, and military equipment. It is an indispensable and important component in the development of the information industry. The process of cutting the ingot into wafers has a direct impact on the precision, quality, efficiency, processing cost, service life of the machine and the difficulty of subsequent processing of the wafer. [0003] At present, the known wafer cutting process is: whole knife-mixing sand solution-pre-cutting-slicing. First of all, the...

AI Technical Summary

Problems solved by technology

First of all, the whole knife is carried out. The traditional process does not refine the wafers with different thickness requirements. Different thicknesses of shims and different pressures are applied to the whole knife. This will cause the preload of the blade to be too large or too small, and the wafers with different thickness requirements are cut The thickness is the same, and there is a large error with the standard thickness, which reduces the efficiency of subsequent grinding and finishing

Then mix the sand liquid. There is no recognized standard for the existing sand liquid configuration. Generally, each manufacturer only has one sand liquid configuration. This will affect the surface quality of wafers with different thicknesses and increase the cost of subsequent finishing. time

Pre-cutting starts after the sand solution is prepared. Generally, the time is used as the standard. The cutting time is one to one and a half hours. It may be because the blade and the ingot have not fully contacted, which will affect the quality of the slice and may even cause the knife to break, or it may have been fully contacted before. And increase the pre-cutting time, thus affecting the processing efficiency

Finally, start slicing. In the past, adding sand once an hour will lead to a thicker sand concentration, resulting in different thickness and quality of the slices.

Images