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Method for realizing connection between chip and substrate with anisotropic conductive film by utilizing ultrasonic vibration

An ultrasonic vibration and anisotropic technology, applied in the field of green microelectronic interconnection technology, can solve the problems of easily damaged chips, low production efficiency, and long bonding time, so as to avoid damage to chips, improve production efficiency, shorten Effect of bonding time

Inactive Publication Date: 2012-07-04
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] It can be seen that the traditional hot pressing process of anisotropic conductive film has the following disadvantages: the bonding time is long, and the production efficiency is not high; the temperature of the bonding head is too high, which is easy to damage the chip

Method used

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  • Method for realizing connection between chip and substrate with anisotropic conductive film by utilizing ultrasonic vibration
  • Method for realizing connection between chip and substrate with anisotropic conductive film by utilizing ultrasonic vibration
  • Method for realizing connection between chip and substrate with anisotropic conductive film by utilizing ultrasonic vibration

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Embodiment 1

[0019] Embodiment 1, combined below figure 1 and figure 2 This embodiment is described, and this embodiment is completed based on an anisotropic conductive adhesive film ultrasonic vibration bonding device. Its bonding method comprises the following steps:

[0020] Step 1: Turn on the anisotropic conductive film transverse ultrasonic vibration bonding device, set the ultrasonic vibration power to 150 (nominal value), the ultrasonic vibration time to 3s, and the bonding pressure to 13N through the operation interface;

[0021] Step 2: Pre-bond the AC-8955YW-23 type anisotropic conductive film 1 to the ITO glass substrate 2, and heat the ITO glass substrate 2 to 80°C through the temperature controller of the bonding table;

[0022] Step 3: Transport the 3 pieces of PCF8576DU / 2DA cores to the working area of ​​the vision system of the image acquisition device by the horizontal transmission device, and collect the image information by the image acquisition device to complete th...

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Abstract

The invention provides a method for realizing connection between a chip and a substrate with an anisotropic conductive film by utilizing ultrasonic vibration. The curing rate of the anisotropic conductive film can be about 94% by applying lateral ultrasonic vibration load under the conditions that the ultrasonic vibration power is 3.42-3.58W, the ultrasonic vibration time is 2.8-3.2 seconds, the substrate temperature is 50-90 DEG C and the bonding pressure is 9-28N, thus completing interconnection between the chip and the ITO (indium tin oxide) glass substrate. The bonding strength of the chip and the substrate is equivalent to the bonding strength in the traditional hot pressing methods. The method has the following beneficial effects: the bonding time is shortened and the bonding efficiency is improved to a great extent; and bonding under normal temperature is realized, thus avoiding the phenomenon similar to the phenomenon that high-temperature pressure heads damage the chips in the traditional hot pressing methods.

Description

technical field [0001] The invention belongs to a green microelectronic interconnection technology. The anisotropic conductive film is solidified by transverse ultrasonic vibration to realize the bonding of the chip and the ITO glass substrate. Background technique [0002] At present, electronic products are developing towards portability, miniaturization and high integration, and the voice of green packaging is getting higher and higher, and the traditional lead-tin alloy is increasingly unable to meet the requirements. Lead is a heavy metal. Lead and its compounds are extremely toxic to humans and livestock. Lead can also pollute water quality. In recent years, in Europe and the United States, the pollution of lead to groundwater has become increasingly prominent. The main reason is the dissolution of lead in the soldering material Sn-Pb alloy in waste electronic products. Long-term exposure to this environment will pose a great threat to human health and even life. Mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/607
CPCH01L24/75
Inventor 蔺永诚金浩方晓南陈明松
Owner CENT SOUTH UNIV
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