Base vibration type semiconductor cold-hot cup
A semiconductor, hot and cold technology, applied in drinking utensils and other directions, can solve the problems of unsatisfactory cooling rate, uneven water temperature distribution, etc., to achieve good market prospects, simple structure, and speed up heat exchange.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0013] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and provides a detailed implementation manner and a specific operation process, but the protection scope of the present invention is not limited to the following implementation. example.
[0014] like figure 1 As shown, this embodiment includes: a casing 1, an aluminum cup 2, an aluminum heat transfer block 3, a thermal insulation cotton 4, an aluminum heat sink 5, a semiconductor sheet 6, a cooling fan 7 and a counterweight 8, wherein: the aluminum heat transfer block 3 Attached to the aluminum cup 2, one side of the semiconductor sheet 6 is attached to the aluminum heat transfer block 3, the other side is attached to the aluminum heat sink 5, and the thermal insulation cotton 4 is arranged between the aluminum heat transfer sheet and the aluminum heat sink 5. In the gap, the cooling fan 7 is arranged...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More - R&D
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com
