Communication device and circuit board structure thereof
A technology for communication devices and circuit boards, applied in printed circuit components, electrical components, magnetic field/electric field shielding, etc., can solve problems such as noise interference, and achieve the effect of reducing the overall volume
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[0042] The present invention will be described in further detail below in combination with specific embodiments and with reference to the accompanying drawings.
[0043] Such as figure 1 Shown is a partial cross-sectional schematic diagram of the circuit board structure of this embodiment. figure 1 Among them, the circuit board structure includes a circuit layer 1 , an insulating layer 2 and a grounding layer 3 , wherein the insulating layer 2 is disposed below the circuit layer 1 , and the grounding layer 3 is disposed below the insulating layer 2 . The circuit board structure includes a plurality of openings 4 , and each opening 4 has a conductive structure, so that the circuit layer 1 can be electrically connected to the ground layer 3 through the openings 4 . Wherein, the circuit layer 1 may be one of lead, tin, silver, copper, gold, bismuth, antimony, zinc, nickel, zirconium, magnesium, indium, tellurium, gallium, palladium and an alloy composed of the aforementioned met...
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Abstract
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