54results about How to "Achieve shielding effect" patented technology

The anti electromagnetic interference material is composed of several layers: the impedance matching layer is made of absorbing type sendust powder, manganese-zinc ferrite and resin; the absorbing layer is made of absorbing type sendust powder, nickel zinc ferrite and resin; the reflecting layer is made of reflection type sendust powder, iron powder and resin.

The invention discloses a low-frequency wideband nacreous layer bionic vibration isolation material. The low-frequency wideband nacreous layer bionic vibration isolation material is provided with a periodic structure consisting of a plurality of basic structure units, wherein each basic structure unit comprises a structure layer I, a connecting layer and a structure layer II which are sequentially connected along the height direction of the periodic structure; the connecting layer comprises four secondary connecting layers which are ranked in a 2*2 matrix and are ranked at equal intervals; each secondary connecting layer comprises a structure layer III as well as a connecting layer I and a connecting layer II which are respectively positioned on the upper and lower surfaces of the structure layer III; the structure layer I, the structure layer II and the structure layer III are made of a material I; the connecting layer I and the connecting layer II are made of a material II; the density of the material I is ymat, wherein ymat is greater than or equal to 1*10<3>kg/m<3> and smaller than or equal to 20*10<3>kg/m<3>; the elasticity modulus of the material II is xmat, wherein xmat is greater than or equal to 0.1Mpa and smaller than or equal to 100Mpa. The basic structure units have the characteristics of quite wide low-frequency band clearance and band clearance designability.

The invention discloses a wafer level metal shielded packaging structure and a manufacturing method thereof. According to the method, in the re-routing and bump manufacturing process, a first conductive structure electrically connected with a chip unit is formed, the front surface of the chip unit is further provided with one or more second conductive structures at the position adjacent to the side surface, the second conductive structures are not conducted with a circuit of the chip unit, a metal shielding layer connected with the second conductive structures is formed at the back and the side edges of the chip unit after the chip unit is cut, the chip unit can be directly installed on a substrate, the second conductive structures are enabled to be electrically connected with a groundingstructure of the substrate, and the metal shielding layer is connected so as to generate a metal shielding effect, so that elements can be effectively prevented from being subjected to electromagneticinterference, and a purpose of reducing the size of the elements is achieved at the same time.

The invention relates to a rotary table used for a face miller, comprising a platform which is provided with two fixed struts and two moving struts. The two fixed struts are horizontally fixed on the platform in parallel; the two moving struts are respectively located in the insides of two fixed struts, one end of each moving strut is articulated with the same end of the two fixed struts and can rotate up and down around the articulated points; vertical strut bars with adjustable height are located between the non-articulated ends of adjacent fixed struts and moving struts, the upper and lower ends of the vertical strut bars are respectively articulated with the moving struts and the fixed struts; locating blocks are fixed on correspondence positions of the upper sides of two moving struts near the articulated ends. By adopting the table to process the steel plates and using the processed steel plates to construct electron accelerator shield chambers, the construction cost can be reduced. The rotary table is applicable in processing the edges of the steel plates into inclined plane and is convenient for the seamless butt joint between the steel plate edges.

The invention discloses a power amplifier with a shielding function, the power amplifier includes a shielding box cover, the shielding box cover is connected with a shielding box body, an electromagnetic shielding layer is laid on the inner surface of the shielding box cover, a conducting layer and a magnetism conducting layer are laid on the inner wall of the shielding box body, the left and right sides of the power amplifier are provided with heat conduction pipe channels, the power amplifier is internally provided with an internal cooling fins, left and right heat conduction pipes are respectively connected at left and right ends of the internal cooling fins, and the left and right heat conduction pipes sequentially stretch out from the power amplifier, a storage cavity and the shielding box body in sequence and are respectively connected with the left and right external cooling fins, and radiating ribs are laid on the surfaces of the left and right external cooling fins. The invention provides the power amplifier with the shielding function, which effectively improves the shielding efficiency by arranging the shielding box, electromagnetic shielding layer, conducting layer andmagnetism conducting layer, and effectively improves the heat dissipation effect of the device by arranging the cooling fins, the heat conduction pipe and the radiating ribs.

The invention discloses a blue ray and ultraviolet absorption adhesive tape and glue and preparation method thereof. The adhesive tape comprises a base material A, a blue ray and ultraviolet absorption adhesive layer, a base material B, a pressure-sensitive adhesive layer and a release film sequentially from top to bottom. The blue ray and ultraviolet absorption adhesive layer is formed by a blueray absorbent, an ultraviolet absorbent, acrylate resin and tackifying resin. The preparation method includes: coating two sides of the base material B with the blue ray and ultraviolet absorption adhesive layer and the pressure-sensitive adhesive layer respectively, drying through a drying tunnel, adhering the base material A on the blue ray and ultraviolet absorption adhesive layer of the base material B in a take-up stage, and laminating the release film on the pressure-sensitive adhesive layer. By the blue ray and ultraviolet absorption adhesive tape, blue ray and ultraviolet protection can be quickly provided for photosensitive materials in a processing process of optical and electronic devices, damages of the materials in a conventional workshop illumination environment are avoided,and defects caused by illumination are reduced.

The invention discloses a micropower intelligent digital directional cellphone signal shielding device, which comprises a programmable logic array, a digital-to-analog converter, at least one channel, an attenuation circuit, a mixing module, a filtering module, an amplifying module and a directional antenna, wherein the programmable logic array is used for generating a baseband modulation signal; the digital-to-analog converter is connected with the programmable logic array, and is used for converting the digital baseband modulation signal generated by the programmable logic array into an analog signal; the at least one channel is connected with the digital-to-analog converter; each channel comprises the attenuation circuit connected with the digital-to-analog converter and the mixing module connected with the attenuation circuit, a local oscillation signal is generated by means of a phase-locked source and a voltage-controlled oscillator and is sent to the mixing module, and the mixing module is used for converting the frequency of an intermediate frequency signal converted by the digital-to-analog converter into a required channel; the filtering module connected with the mixing module is used for filtering the signal generated by the mixing module; the amplifying module connected with the filtering module is used for amplifying the signal filtered by the filtering module; and the directional antenna connected with the amplifying module is used for transmitting channel power. The micropower intelligent digital directional cellphone signal shielding device has the advantages of good shielding effect, low radiation and the like.

The invention discloses an outdoor power plug with a shielding connection structure. The plug comprises a shell; a shielding spring; and a tail shell. A triangular spring is fixedly clamped on the inner side wall of the middle part of the tail shell; when a power supply cable is installed in the rear end of the plug, the contact position of a cable conductor of the power supply cable and the conductive combination piece is locked in place, and the triangular spring is tightly attached to the outside of a shielding layer of the power supply cable in a wrapping mode. when the front end of the plug is in butt joint with a socket, the outer surface of the shielding spring is in close contact with the shell of the socket. Through reliable contact between the triangular spring and the shielding spring and a connector main body, the whole power supply cable assembly circuit achieves a shielding effect, and the whole circuit can achieve an anti-lightning stroke performance effect.

The invention discloses an ion source device with adjustable plasma density. The ion source device comprises a discharge cavity, a spiral coil and an ion source cavity which are coaxially arranged in sequence from inside to outside, the metal foil is arranged on the outer wall surface of the discharge cavity and can shield the magnetic field intensity of the inner edge of the discharge cavity and neutralize high plasma density caused by the skin effect, so that the plasma density distribution in the discharge cavity is uniform. The width W of the metal foil ranges from 1 mm to 20 mm, the thickness T of the metal foil ranges from 0.1 mm to t, and t is the skin depth; and selecting the thickness T and the surface area of the metal foil according to the difference between the edge plasma density and the central region plasma density in the discharge cavity. The Faraday structure is additionally arranged outside the discharge cavity, power distribution is carried out on the Faraday structure, plasma density adjustment is carried out according to different working conditions, and therefore the etching uniformity is effectively improved.

The invention is concerned with the multi-core screen broad-band cable, includes: the oversheath, the lapping in the oversheath, several sub-unit in the lapping. It is: each sub-unit includes several pair of cable that is set the stabbing out of it; the stabbing covers the lapping belt that is set screen layer out of it. The aluminum model aluminum belt screen layer can avoid the interfere between the sub-units effectively that can screen for the radiation and interfere from outside in order to satisfy the need of one tube with multi-core cable of the user.

The invention provides a shielding apparatus for a high-intensity magnetic field. According to the shielding apparatus for the high-intensity magnetic field, the shielding apparatus is a composite shielding apparatus comprising multiple layers of shielding devices, and the multiple layers of shielding devices are formed by coaxially surrounding shielding covers made of various different materials; the innermost layer of the composite shielding apparatus is provided with a magnetism gathering ring, and one side of the magnetism gathering ring is provided with an opening; an air gap structure is arranged on the shielding device on the outermost layer of the composite shielding apparatus; and the opening of the air gap structure and the opening of the magnetism gathering ring are arranged back to back. The shielding apparatus is designed to be of a multi-layer structure, and different layers are formed by combining different materials, so the shielding apparatus solves the problem of magnetic saturation of the shielding covers in a strong magnetic field environment; and in a high magnetic field interference environment, even if the shielding cover on the outer layer is magnetically saturated, the shielding cover on the innermost layer still effectively protects a shielded body to achieve a shielding effect. Meanwhile, the apparatus is not totally closed and is of an open type shielding structure capable of being used for measuring the magnetic field of a wire, and air gaps are reasonably arranged on the outer layer of the multi-layer shielding structure, so premature saturation is prevented, and the heating condition caused by the eddy current effect under an alternating current magnetic field is reduced.

The invention relates to the technical field of self-insulation state detection of high-voltage capacitive equipment in a power grid system. Aiming at the problem exposed by an existing test instrument that the whole end screen grounding circuit of the junction box type device is broken and an active sensor type device is poor in reliability and a memory test system is difficult to check regularly, the invention discloses a dielectric loss live-line testing device for wireless sensing capacitive equipment. The device comprises a signal sampling unit 101, a host terminal 103, a wireless transmission unit 102 and a thermal printer 104. The output end of the signal sampling unit 101 is connected with the input end of the wireless transmission unit 102 in a wired communication mode. The outputend of the wireless transmission unit 102 is connected with the host terminal 103 in a wireless communication manner. The thermal printer 104 is connected with the host terminal 103 in a Bluetooth communication manner. The signal sampling unit comprises a current signal sampling unit and a voltage signal sampling unit.

The invention provides a wafer packaging method and packaging structure. The method comprises the steps of: providing a device wafer, forming a plurality of first chips in the device wafer, and forming first electrodes on the first chips; forming first dielectric layers and first conductive bumps on the device wafer, the surfaces of the sides, far away from the first chips, of the first dielectric layers and the first conductive bumps being flush; forming second electrodes on second chips; forming second dielectric layers and second conductive bumps on the second chips, the surfaces of the sides, far away from the second chips, of the second dielectric layers and the second conductive bumps being flush; aligning and bonding the second dielectric layers and the first dielectric layers as well as the second conductive bumps and the first conductive bumps; forming an insulating layer covering the first dielectric layer, the second chips, and the second dielectric layers, the second electrodes and the second conductive bumps exposed out of the second chips in a shape-preserving manner; covering the insulating layer with a shielding layer in a shape-preserving manner; and forming a packaging layer on the shielding layer. According to the invention, the packaging method is simplified, and the size of the formed packaging structure is reduced.