54results about How to "Achieve shielding effect" patented technology

The anti electromagnetic interference material is composed of several layers: the impedance matching layer is made of absorbing type sendust powder, manganese-zinc ferrite and resin; the absorbing layer is made of absorbing type sendust powder, nickel zinc ferrite and resin; the reflecting layer is made of reflection type sendust powder, iron powder and resin.

The invention discloses a novel shielding and sealing tail accessory part, comprising a first assembly and a second assembly. The first assembly comprises a locking screw thread sleeve (1), a tail shell (3), an elastic clamping ring (4), a first O-shaped ring (2) and a second O-shaped ring (5); the second assembly comprises a tail sleeve (6), a pressing ring (7), a sealed rubber tube (8) and a top ring (9). The top ring (9) supports against the tail end of the tail sleeve (6); the inner surface of one side of the loading end of the tail sleeve (6) is provided with tail sleeve threads (61); the outer surface of the stretching-in end of the tail shell (3) is provided with tail shell threads (31) which are correspondingly connected with the tail sleeve threads (61); the forefront end of the stretching-in end of the tail shell (3) is provided with a tail shell slope (32); and the pressing ring (7) is provided with a pressing ring slope (74) which is matched and pressed with the tail shell slope (31) to make a cable shielding layer fixed and connected with a connector to fulfill the shielding function. The novel shielding and sealing tail accessory part can meet the three requirements of using fewer site parts and shielding and sealing a cable.

The invention provides a coupling capacitive voltage divider with electric potential gradient shielding. The coupling capacitive voltage divider comprises a high voltage terminal shielding ring, an upper flange, a device body, a base and a connecting box. The high voltage terminal shielding ring is located at the top of the device body and is connected with the device body through the upper flange, the bottom of the device body is fixed to the base, and the connecting box is arranged on the base. On the basis that the capacitance of the coupling capacitive voltage divider is reduced, the intrinsic standoff ratio of the voltage divider is not affected by external objects and electric fields. The coupling capacitive voltage divider with electric potential gradient shielding can be used as a coupling capacitor to be used for EVT and to be used for improving the transient process withstanding capacity of an EVT secondary system; the coupling capacitive voltage divider with electric potential gradient shielding can also be used as a supporting insulator with the function of the voltage divider to be used for monitoring transformer substation voltage and measuring power grid transient state overvoltage, and used for primary voltage monitoring of transformer substation and circuit system debugging. The coupling capacitive voltage divider with electric potential gradient shielding can also be used in a CVT with higher insulating property and lower power consumption.

The invention discloses a low-frequency wideband nacreous layer bionic vibration isolation material. The low-frequency wideband nacreous layer bionic vibration isolation material is provided with a periodic structure consisting of a plurality of basic structure units, wherein each basic structure unit comprises a structure layer I, a connecting layer and a structure layer II which are sequentially connected along the height direction of the periodic structure; the connecting layer comprises four secondary connecting layers which are ranked in a 2*2 matrix and are ranked at equal intervals; each secondary connecting layer comprises a structure layer III as well as a connecting layer I and a connecting layer II which are respectively positioned on the upper and lower surfaces of the structure layer III; the structure layer I, the structure layer II and the structure layer III are made of a material I; the connecting layer I and the connecting layer II are made of a material II; the density of the material I is ymat, wherein ymat is greater than or equal to 1*10<3>kg / m<3> and smaller than or equal to 20*10<3>kg / m<3>; the elasticity modulus of the material II is xmat, wherein xmat is greater than or equal to 0.1Mpa and smaller than or equal to 100Mpa. The basic structure units have the characteristics of quite wide low-frequency band clearance and band clearance designability.

The invention discloses a wafer level metal shielded packaging structure and a manufacturing method thereof. According to the method, in the re-routing and bump manufacturing process, a first conductive structure electrically connected with a chip unit is formed, the front surface of the chip unit is further provided with one or more second conductive structures at the position adjacent to the side surface, the second conductive structures are not conducted with a circuit of the chip unit, a metal shielding layer connected with the second conductive structures is formed at the back and the side edges of the chip unit after the chip unit is cut, the chip unit can be directly installed on a substrate, the second conductive structures are enabled to be electrically connected with a groundingstructure of the substrate, and the metal shielding layer is connected so as to generate a metal shielding effect, so that elements can be effectively prevented from being subjected to electromagneticinterference, and a purpose of reducing the size of the elements is achieved at the same time.

The invention relates to a rotary table used for a face miller, comprising a platform which is provided with two fixed struts and two moving struts. The two fixed struts are horizontally fixed on the platform in parallel; the two moving struts are respectively located in the insides of two fixed struts, one end of each moving strut is articulated with the same end of the two fixed struts and can rotate up and down around the articulated points; vertical strut bars with adjustable height are located between the non-articulated ends of adjacent fixed struts and moving struts, the upper and lower ends of the vertical strut bars are respectively articulated with the moving struts and the fixed struts; locating blocks are fixed on correspondence positions of the upper sides of two moving struts near the articulated ends. By adopting the table to process the steel plates and using the processed steel plates to construct electron accelerator shield chambers, the construction cost can be reduced. The rotary table is applicable in processing the edges of the steel plates into inclined plane and is convenient for the seamless butt joint between the steel plate edges.

The present invention discloses an antenna bunching buckle device, an electronic device and a bunching method. The device comprises a plurality of antenna bunching buckle bodies, and the plurality of antenna bunching buckle bodies are all fixed on an external PCB and are distributed at intervals along a routing direction of an antenna, wherein each antenna bunching buckle body comprises a wire fastening groove and an installing piece which are connected mutually, the wire fastening groove is used to clamp the outer surface of the antenna, and the installing piece is packaged and fixed on the PCB. A signal shielding layer is formed after the plurality of antenna bunching buckle bodies are grounded, and is used to protect the signal transmission of the antenna. According to the present invention, the manufacturing requirement and cost of a chassis are reduced, the size of the device is reduced, and the space is saved. The plurality of antenna bunching buckle bodies can guide the antenna to any direction, thereby reducing the wiring difficulty of the antenna. Meanwhile, the antenna can be grounded, thereby realizing a shielding effect, and protecting the signal transmission of the antenna.

The invention provides a SIP (System In Package) module partition electromagnetic shielding package method. The method comprises the steps of: providing a substrate, mounting a flip chip and a passiveelement at the first working surface of the substrate, wherein manufactured grounding bonding pads are arranged at the periphery of the chip mounting position of the first working surface of the substrate; performing plasma surface cleaning for the substrate, performing thin film plastic package for the first working surface of the substrate to form a plastic package film covering the first working surface of the substrate; employing a laser to perform slotting around the chip requiring partition shielding to expose the corresponding grounding bonding pads; performing sputtering for the firstworking surface of the whole substrate to form an inner metal shielding layer and achieve chip partition shielding; performing plasma cleaning for the substrate after sputtering, and performing plastic package for the first surface of the substrate to form an outer package body; and cutting the whole substrate to form each single SIP module. The SIP module partition electromagnetic shielding package method facilitates reduction of the module size, improves the reliability and improves the production efficiency.

The invention discloses a power amplifier with a shielding function, the power amplifier includes a shielding box cover, the shielding box cover is connected with a shielding box body, an electromagnetic shielding layer is laid on the inner surface of the shielding box cover, a conducting layer and a magnetism conducting layer are laid on the inner wall of the shielding box body, the left and right sides of the power amplifier are provided with heat conduction pipe channels, the power amplifier is internally provided with an internal cooling fins, left and right heat conduction pipes are respectively connected at left and right ends of the internal cooling fins, and the left and right heat conduction pipes sequentially stretch out from the power amplifier, a storage cavity and the shielding box body in sequence and are respectively connected with the left and right external cooling fins, and radiating ribs are laid on the surfaces of the left and right external cooling fins. The invention provides the power amplifier with the shielding function, which effectively improves the shielding efficiency by arranging the shielding box, electromagnetic shielding layer, conducting layer andmagnetism conducting layer, and effectively improves the heat dissipation effect of the device by arranging the cooling fins, the heat conduction pipe and the radiating ribs.

The invention discloses a blue ray and ultraviolet absorption adhesive tape and glue and preparation method thereof. The adhesive tape comprises a base material A, a blue ray and ultraviolet absorption adhesive layer, a base material B, a pressure-sensitive adhesive layer and a release film sequentially from top to bottom. The blue ray and ultraviolet absorption adhesive layer is formed by a blueray absorbent, an ultraviolet absorbent, acrylate resin and tackifying resin. The preparation method includes: coating two sides of the base material B with the blue ray and ultraviolet absorption adhesive layer and the pressure-sensitive adhesive layer respectively, drying through a drying tunnel, adhering the base material A on the blue ray and ultraviolet absorption adhesive layer of the base material B in a take-up stage, and laminating the release film on the pressure-sensitive adhesive layer. By the blue ray and ultraviolet absorption adhesive tape, blue ray and ultraviolet protection can be quickly provided for photosensitive materials in a processing process of optical and electronic devices, damages of the materials in a conventional workshop illumination environment are avoided,and defects caused by illumination are reduced.

The surface of the image pickup device 21 is covered by a transparent conductive member 26 that is made of, for example, a transparent conductive past resin and that is electrically connected to a ground potential GND. By having this arrangement, it is possible to electromagnetically shield the image pickup device 30 itself. The transparent conductive member 26 has one or more openings in the parts that correspond to the conductive unit of the signal wiring portion (the electrodes 23; A to D, F, and G, and the wiring patterns 25 that are connected thereto), out of the electrodes 23 and the wiring patterns 25 provided on the front surface side of the image pickup device body unit 21.

The invention discloses a method for preparing an electromagnetic shielding flame-retardant fiberboard, which belongs to the technical field of a decoration material. In the invention, silicon gel coated ammonium polyphosphate is used to prepare silicon gel microencapsulated ammonium polyphosphate, an element in the silicon gel microencapsulated ammonium polyphosphate has high thermal stability, and the amount of a flame retardant is reduced. In the process of copolymerization of acrylonitrile and butadiene, due to the existence of active reaction points in the nanographite sheets, the graphite sheet layer is nanodispersed in a rubber matrix under emulsion blending, a certain intercalation structure is existed, the potential active sites on the nanographite sheet are in full contact with the rubber molecules, self-vulcanization is carried out, so that the interference field forms eddy currents in an elastic material, and reflection is generated on the surface of the elastic material, and the shielding effect can be achieved, moreover, the copper powder with high magnetic permeability is added to the nano-reinforced nitrile rubber, the eddy current effect is increased, and the electromagnetic shielding effect is increased.

The invention discloses a micropower intelligent digital directional cellphone signal shielding device, which comprises a programmable logic array, a digital-to-analog converter, at least one channel, an attenuation circuit, a mixing module, a filtering module, an amplifying module and a directional antenna, wherein the programmable logic array is used for generating a baseband modulation signal; the digital-to-analog converter is connected with the programmable logic array, and is used for converting the digital baseband modulation signal generated by the programmable logic array into an analog signal; the at least one channel is connected with the digital-to-analog converter; each channel comprises the attenuation circuit connected with the digital-to-analog converter and the mixing module connected with the attenuation circuit, a local oscillation signal is generated by means of a phase-locked source and a voltage-controlled oscillator and is sent to the mixing module, and the mixing module is used for converting the frequency of an intermediate frequency signal converted by the digital-to-analog converter into a required channel; the filtering module connected with the mixing module is used for filtering the signal generated by the mixing module; the amplifying module connected with the filtering module is used for amplifying the signal filtered by the filtering module; and the directional antenna connected with the amplifying module is used for transmitting channel power. The micropower intelligent digital directional cellphone signal shielding device has the advantages of good shielding effect, low radiation and the like.

The invention discloses a cargo outer package disinfection device. The whole device is S-shaped, one side of the device is an input end, the other side of the device is an output end, and an input transition bin, an input arc shielding bin, an adjusting bin, a disinfection bin, an output arc shielding bin and an output transition bin are sequentially arranged from the input end to the output end; adjustable quick hasps are arranged on four sides of each bin body and are used for detachably connecting the adjacent bin bodies; and mirror stainless steel is arranged on the inner wall of the disinfection bin, and multiple sets of angle-adjustable pulsed accent light lamps are arranged on the four surfaces in the disinfection bin. According to the device, the adjustable quick hasps are arranged among all the structural bodies, so that the whole device can be quickly disassembled and assembled in a very short time and put into operation again, and the flexibility is extremely high. Besides, black sound absorption cotton is mounted on the arc-shaped inner wall of the S-shaped structure, the arc-shaped inner wall can conduct diffuse reflection on the light, beside, a light absorption material can consume the harmful light, and therefore, the effect of shielding the harmful light is achieved.

The invention discloses a preparation method of an electromagnetic shielding elastic material for sealing, and belongs to the technical field of elastic material preparation. In the process of copolymerization of acrylonitrile and butadiene in a nanographite sheet of the invention, due to the existence of active reaction points in a nanographite sheet layer, and the fine dispersion of nanographiteand the polar interaction of polar functional groups on a graphite sheet layer and rubber groups, strong interfacial bonding between graphite and a matrix is produced, so that an interference field forms eddy currents inside an elastic material and reflection is produced on the surface of the elastic material, to weaken the influence of the interference field on an elastic sealing material so asto achieve the shielding effect, sweet potato powder, glycerin and water are mixed and dispersed at a high speed and then extruded by an extruder to obtain a sweet potato starch material, thereby retarding continuous decomposition of polyvinyl chloride, and the prepared elastic material is filled with polylactic acid and paper fibers having strong toughness, so that the elasticity and toughness ofthe elastic material are enhanced, and the elastic material has the characteristics of easy degradation and recycling and reusability and further has broad application prospects.

The invention discloses a miniaturized blood irradiation device which comprises a blood cup, a plurality of radioactive sources, a plurality of radioactive source pipe racks, a radiation shielding cover and a box body. According to the blood irradiation device, a thin shielding system can be selected, so that the piece weight of the device is reduced, the device has better mobility, meanwhile, the energy consumption of the device is greatly reduced, the reliability, maintainability, replaceability, combination, integration and the like of the device are greatly improved compared with those of commercially available products, and the device can be used for medical treatment and public health departments and units which need to use irradiation blood in urban blood centers, surgical hospitals and field hospitals.

The invention discloses split electromagnetic shielding protective clothing, which comprises an upper outer garment, trousers and a hat, wherein the hat is connected together with the upper outer garment; a face mask is adhered to the hat; a transparent material is arranged at the eyes of the face mask; bottom covering cloth and bottom buckles are arranged at the bottom of the upper outer garment; trouser buckles matched with the bottom buckles are arranged at the hip circumference of the trousers; and the upper outer garment is connected with the trousers through the bottom buckles and the trouser buckles. By the split electromagnetic shielding protective clothing, a shielding protection function in the parts such as the chest, the abdomen and the like of a wearer is realized, electromagnetic radiation can be shielded or attenuated, and the damage of the electromagnetic radiation to a human body can be reduced. The split electromagnetic shielding protective clothing is applied to workers of a mild electromagnetic radiation pollution source area.

The invention discloses an ion source device with adjustable plasma density. The ion source device comprises a discharge cavity, a spiral coil and an ion source cavity which are coaxially arranged in sequence from inside to outside, the metal foil is arranged on the outer wall surface of the discharge cavity and can shield the magnetic field intensity of the inner edge of the discharge cavity and neutralize high plasma density caused by the skin effect, so that the plasma density distribution in the discharge cavity is uniform. The width W of the metal foil ranges from 1 mm to 20 mm, the thickness T of the metal foil ranges from 0.1 mm to t, and t is the skin depth; and selecting the thickness T and the surface area of the metal foil according to the difference between the edge plasma density and the central region plasma density in the discharge cavity. The Faraday structure is additionally arranged outside the discharge cavity, power distribution is carried out on the Faraday structure, plasma density adjustment is carried out according to different working conditions, and therefore the etching uniformity is effectively improved.

The invention is concerned with the multi-core screen broad-band cable, includes: the oversheath, the lapping in the oversheath, several sub-unit in the lapping. It is: each sub-unit includes several pair of cable that is set the stabbing out of it; the stabbing covers the lapping belt that is set screen layer out of it. The aluminum model aluminum belt screen layer can avoid the interfere between the sub-units effectively that can screen for the radiation and interfere from outside in order to satisfy the need of one tube with multi-core cable of the user.

An LED power supply disclosed by the invention comprises a circuit board assembly, wherein the circuit board assembly is provided with a high-voltage input end, a rectification filtering circuit, a driving control module, a step-down transformer, a DC-DC circuit and an LED connection end which are electrically connected in sequence, the driving control module at least comprises a control unit and a switch unit, the circuit board assembly comprises a main board and at least one first daughter board which is electrically connected with the main board and is perpendicular to the main board, and the driving control module is arranged on the first daughter board. According to the LED power supply disclosed by the invention, the circuit board is modularized, the plug board form is adopted, the electronic components are stereoscopically arranged, and the sizes among the components are compact, so that the overall size of a product can be greatly reduced, and the requirement of miniaturization of the product is met.

The invention provides a shielding apparatus for a high-intensity magnetic field. According to the shielding apparatus for the high-intensity magnetic field, the shielding apparatus is a composite shielding apparatus comprising multiple layers of shielding devices, and the multiple layers of shielding devices are formed by coaxially surrounding shielding covers made of various different materials; the innermost layer of the composite shielding apparatus is provided with a magnetism gathering ring, and one side of the magnetism gathering ring is provided with an opening; an air gap structure is arranged on the shielding device on the outermost layer of the composite shielding apparatus; and the opening of the air gap structure and the opening of the magnetism gathering ring are arranged back to back. The shielding apparatus is designed to be of a multi-layer structure, and different layers are formed by combining different materials, so the shielding apparatus solves the problem of magnetic saturation of the shielding covers in a strong magnetic field environment; and in a high magnetic field interference environment, even if the shielding cover on the outer layer is magnetically saturated, the shielding cover on the innermost layer still effectively protects a shielded body to achieve a shielding effect. Meanwhile, the apparatus is not totally closed and is of an open type shielding structure capable of being used for measuring the magnetic field of a wire, and air gaps are reasonably arranged on the outer layer of the multi-layer shielding structure, so premature saturation is prevented, and the heating condition caused by the eddy current effect under an alternating current magnetic field is reduced.

The invention, which belongs to the PCB field, provides a PCB connector and a PCB connection structure. The PCB connector comprises a PCB adapter board and L-shaped short-row pins. The pin part is installed and fixed partially at the upper and lower end portions of the PCB adapter board; and positioning columns for positioning and bosses for installing a PCB conveniently are arranged at one end portion of the PCB adapter board. The PCB adapter board carries out ground copper cladding based on needs to realize shielding, so that the signal is protected from being affected and the signal transmission quality is ensured. According to the invention, on the basis of combination of the PCB adapter board and the d L-shaped short-row pins, problems that the connection height and routing are limited between the PCBs are solved; with the copper cladding of the PCB, the signal is protected from being affected; and with the positioning columns, the pre alignment function is realized and thus connector pins are protected from being damaged.

The invention relates to the technical field of self-insulation state detection of high-voltage capacitive equipment in a power grid system. Aiming at the problem exposed by an existing test instrument that the whole end screen grounding circuit of the junction box type device is broken and an active sensor type device is poor in reliability and a memory test system is difficult to check regularly, the invention discloses a dielectric loss live-line testing device for wireless sensing capacitive equipment. The device comprises a signal sampling unit 101, a host terminal 103, a wireless transmission unit 102 and a thermal printer 104. The output end of the signal sampling unit 101 is connected with the input end of the wireless transmission unit 102 in a wired communication mode. The outputend of the wireless transmission unit 102 is connected with the host terminal 103 in a wireless communication manner. The thermal printer 104 is connected with the host terminal 103 in a Bluetooth communication manner. The signal sampling unit comprises a current signal sampling unit and a voltage signal sampling unit.

The anti electromagnetic interference material is composed of several layers: the impedance matching layer is made of absorbing type sendust powder, manganese-zinc ferrite and resin; the absorbing layer is made of absorbing type sendust powder, nickel zinc ferrite and resin; the reflecting layer is made of reflection type sendust powder, iron powder and resin.

The invention discloses a low-frequency broadband nacre bionic vibration isolation material, which has a periodic structure, and the periodic structure is composed of a plurality of basic structural units; A connected structural layer, a connecting layer and a structural layer two; the connecting layer includes four secondary connecting layers arranged in a 2×2 matrix, and the four secondary connecting layers are arranged at equal intervals; the secondary connecting layer It includes a structural layer 3 and connecting layer 1 and connecting layer 2 respectively located on the upper and lower sides of the structural layer 3; the material of the structural layer 1, the structural layer 2 and the structural layer 3 is material 1, the The material of the connection layer one and the connection layer two is material two; the density of the material one is y mat , 1×10 3 kg / m 3 ≤y mat ≤20×10 3 kg / m 3 ; The modulus of elasticity of the material two is x mat , 0.1Mpa≤x mat ≤100Mpa. The basic structural unit of the present invention has a relatively wide low-frequency band gap, and the band gap can be designed.

The invention discloses a communication device which comprises a circuit board, a first metal shielding structure, a radio frequency circuit and a fundamental frequency circuit, wherein the circuit board comprises a circuit layer, an insulation layer and a grounding layer; the insulation layer is arranged below the circuit layer, the grounding layer is arranged below the insulation layer, and thegrounding layer upwards passes through the insulation layer and is provided with an isolated body in an extending way so as to isolate a first circuit area from a second circuit area; the first circuit area and the grounding end of the second circuit area are electrically connected with the grounding layer, and a gap is arranged between the first circuit area and the isolated body; and the radio frequency circuit is arranged on the first circuit area, the foundational frequency circuit is arranged on the second circuit area, and the first metal shielding structure is arranged above the circuit board structure and electrically connected with the isolated body so that the first circuit area and the second circuit area are not easy to interfer by respective noise.

The invention provides a wafer packaging method and packaging structure. The method comprises the steps of: providing a device wafer, forming a plurality of first chips in the device wafer, and forming first electrodes on the first chips; forming first dielectric layers and first conductive bumps on the device wafer, the surfaces of the sides, far away from the first chips, of the first dielectric layers and the first conductive bumps being flush; forming second electrodes on second chips; forming second dielectric layers and second conductive bumps on the second chips, the surfaces of the sides, far away from the second chips, of the second dielectric layers and the second conductive bumps being flush; aligning and bonding the second dielectric layers and the first dielectric layers as well as the second conductive bumps and the first conductive bumps; forming an insulating layer covering the first dielectric layer, the second chips, and the second dielectric layers, the second electrodes and the second conductive bumps exposed out of the second chips in a shape-preserving manner; covering the insulating layer with a shielding layer in a shape-preserving manner; and forming a packaging layer on the shielding layer. According to the invention, the packaging method is simplified, and the size of the formed packaging structure is reduced.

The invention relates to a instant communications field and provides a method and a system for screening chatting information of a discussion group in instant communications. The method includes the following steps: A. receiving new chatting information of the discussion group and renewing the information content in a chatting record frame; B. obtaining a locking and setting parameter by the userand judging whether the discussion group is in a locking state according to the locking and setting parameter, ending the steps if the discussion group is in a locking state and carrying out the stepC if the discussion group is not in a locking state; C. displaying a conversation frame with high brightness of the discussion group on a user interface. On the basis of locking and setting the discussion group by the user, the invention carries out flexible processing for the chatting information of the discussion group; therefore, the screening effect is reached, the valuable information is kept by the user, and the flexibility of the instant communications mode is further improved with better humanization and convenience for utilization for the user.

The invention discloses a shielding cover structure. The shielding cover structure comprises a shielding cover rack and also comprises a flexible printed circuit (FPC), wherein the FPC is bonded with the shielding cover rack by a conductive adhesive layer. With the adoption of the FPC as a shielding cover, metal wiring inside the FPC can achieve a shielding effect, an insulation effect can be achieved by an insulation layer of the shielding cover structure, and the weight of the shielding cover can be greatly reduced; moreover, the FPC is relatively small in volume, the space of other components cannot be compressed; the FPC and the shielding cover rack are bonded by the conducive adhesive layer, the fabrication process is simple, the requirement for a fabrication device is reduced, and the fabrication cost is saved; meanwhile, the FPC is made of a flexible material, the shielding of a space curved-surface product can be achieved; and moreover, heat can be effectively dissipated, the temperature of the whole machine is reduced, and a favorable environment is provided for the running of the whole machine.