An
electronic circuit module includes a circuit board on which electronic components are mounted, and a
metal cover covering the circuit board. The
metal cover includes a top plate disposed so as to face the circuit board, side plates, and mounting legs. The circuit board has lands to which the mounting legs are joined. The mounting legs each have a bent portion located on the outer periphery of the top plate of the
metal cover, and a mounting leg fixing portion in contact with the lands of the circuit board. When seen from the upper surface of the circuit board, the position of the bent portion is on the inner side of the position of the mounting leg fixing portion, and the width of the bent portion is greater than the width of the mounting leg fixing portion.