Low-frequency wideband nacreous layer bionic vibration isolation material

Abstract

The invention discloses a low-frequency wideband nacreous layer bionic vibration isolation material. The low-frequency wideband nacreous layer bionic vibration isolation material is provided with a periodic structure consisting of a plurality of basic structure units, wherein each basic structure unit comprises a structure layer I, a connecting layer and a structure layer II which are sequentially connected along the height direction of the periodic structure; the connecting layer comprises four secondary connecting layers which are ranked in a 2*2 matrix and are ranked at equal intervals; each secondary connecting layer comprises a structure layer III as well as a connecting layer I and a connecting layer II which are respectively positioned on the upper and lower surfaces of the structure layer III; the structure layer I, the structure layer II and the structure layer III are made of a material I; the connecting layer I and the connecting layer II are made of a material II; the density of the material I is ymat, wherein ymat is greater than or equal to 1*10<3>kg/m<3> and smaller than or equal to 20*10<3>kg/m<3>; the elasticity modulus of the material II is xmat, wherein xmat is greater than or equal to 0.1Mpa and smaller than or equal to 100Mpa. The basic structure units have the characteristics of quite wide low-frequency band clearance and band clearance designability.

Description

technical field [0001] The invention relates to a vibration isolation material, in particular to a low-frequency broadband nacre bionic vibration isolation material. Background technique [0002] The core of traditional vibration reduction technology is the use of damping and vibration reduction materials, such as rubber, resin and other materials. These materials are usually single-phase polymer materials or a mixture of several polymer materials. The polymer material is made of long, soft curly It is composed of entangled molecules, occasionally coupled with chemical bonds, and has a high damping coefficient. Damping is the process of converting the vibration energy of the system into other forms of energy during the vibration process and dissipating it. It can be dissipated through the internal friction between its internal polymers. Other forms of energy include thermal energy, electrical energy, magnetic energy, etc. Damping reduces the amount of vibration, impact and ...

AI Technical Summary

Problems solved by technology

[0004] Traditional damping and vibration-reducing materials are based on the internal friction energy dissipation mechanism. The effect of vibration reduction at low frequencies is not significant, and there is a problem that the target bandwidth frequency cannot be designed. For fields with different bandwidth frequencies, different types of materials need to be designed, and the vibration-reduction range cannot be covered.

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