Electromagnetic wave interference preventive material and production thereof
An anti-electromagnetic wave, manufacturing method technology, applied in electrical components, magnetic field/electric field shielding and other directions, can solve the problems of unsatisfactory reflection and absorption ability, unsatisfactory bonding, small specific surface area of materials, etc., to achieve light weight, processing Ease of use and improved specific surface area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0027]Embodiment: The anti-electromagnetic wave interference material is composed of an impedance matching layer, an absorbing layer, and a reflecting layer; the impedance matching layer is made of materials including absorbing sendust powder, manganese-zinc ferrite and resin; the The absorption layer is made of materials including absorption type sendust powder, nickel zinc ferrite and resin; the reflection layer is made of materials including reflection type sendust powder, iron powder and resin.
[0028] Table 1 Component distribution ratio of absorption sendust powder
[0029]
[0030] The preparation process of absorption-type sendust powder is as follows: First, weigh various raw materials according to the formula; put them into a ball mill and mix them for 2.5 hours; then melt them at 1800°C for 8 hours; water pressure atomize them into 150-mesh particles; put them into a ball mill Medium ball milling for 3 hours; then carry out vacuum insulation at 700°C f...
PUM
Property | Measurement | Unit |
---|---|---|
density | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
electrical resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com