Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same

A technology for printed circuit substrates and resin compositions, applied in the directions of printed circuit manufacturing, printed circuits, manufacturing tools, etc., can solve the problems of fine cracks in the coating layer, decreased adhesion, etc., to achieve excellent adhesion, single manufacturing process, The effect of excellent uniformity and correctness

Inactive Publication Date: 2011-08-03
SANG A FRONTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a lubricating substance is directly applied to a metal substrate without an undercoat layer, there is a problem that the adhesive force decreases and peeling occurs in winter, causing fine cracks in the coating layer.

Method used

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  • Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same
  • Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same
  • Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0072] Example 1: Manufacture of water-soluble lubricating resin composition for cover plate

Embodiment 1-

[0074] A 500 mL two-necked flask was replaced with nitrogen, 1,4-butanediol was charged at a content of 135.18 g (1.5 moles) as ethylene glycol, and dimethyl isophthalate-5-sodium sulfonate was used as a water-soluble component Salt was added at a content of 44.43 g (0.15 mol). Then, 0.2 g of tetrabutyl titanate was added as a catalyst, and the temperature was gradually raised under a nitrogen atmosphere to perform transesterification while maintaining the internal temperature at 200° C. or lower. After the by-product methanol has completely flowed out, add 0.85 moles of adipic acid as a dicarboxylic acid, add 0.2 g of tetrabutyl titanate as a catalyst, and 0.1 g of triphenyl phosphate as a stabilizer, while maintaining the internal temperature at 200°C in the same way. The esterification reaction is carried out while the by-product water is discharged. After the esterification reaction, 0.1 g of tetrabutyl titanate and 0.1 g of zinc acetate were added to the reaction system ...

Embodiment 1-(7

[0087] The water-soluble polyester resin was applied by mixing VMCH and P-125 at a content of 3 parts by weight in the same manner as in the above-mentioned Example 1-(1), and its state was observed.

[0088] Embodiment 1-(8)

[0089] The water-soluble polyester resin was the same as in the above-mentioned Example 1-(1), and VMCH and P-125 were mixed and coated at a content of 5 parts by weight, respectively, and the state was observed.

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Abstract

The present invention relates to an entry sheet for printed circuit board hole boring, a water-soluble lubricating resin composition used with same and a production method for the same. The entry sheet for printed circuit board hole boring, comprises: a metal thin film substrate; and a water-soluble lubricating resin layer formed on the substrate, wherein the water-soluble lubricating resin layer comprises 100 parts by weight of a water-soluble polyester resin, from 0.5 to 3 parts by weight of a vinyl chloride - vinyl acetate copolymer and from 0.5 to 3 parts by weight of a hydrogenated hydrocarbon resin. In entry sheets produced in this way, the uniformity and accuracy of the bored holes is outstanding, the force of binding onto the metal thin film is exceptional, and there is no peeling or crack generation on the surface even at low temperature.

Description

technical field [0001] The present invention relates to an entry sheet for perforating a printed circuit board, and more particularly to an entry sheet having excellent uniformity and accuracy of perforated holes, and having excellent adhesion to metal thin films, and does not occur on the surface even at low temperatures. A cracked and peeled cover plate for punching holes in printed circuit boards and a method for producing a water-soluble lubricating resin composition forming the cover plate. Background technique [0002] Recently, as improvements in reliability and densification are required for printed circuit boards, high-level perforation techniques such as accuracy of hole positions are also required. For this purpose a cover plate is used in the perforation of the printed circuit board. The cover plate can dissipate the heat generated during hole processing, and the coating layer of the cover plate can lubricate while melting when piercing. In addition, when using ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B41/00B23B35/00C09D133/04C09D131/04C09D5/00H05K3/00B32B15/09
CPCC08J5/18C08L27/06C08L31/04C09D167/00C10M107/32H05K3/005
Inventor 洪昌壹田镇秀睦进揆权令大
Owner SANG A FRONTEC
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