Machining method for milling tungsten alloy target material

A processing method, tungsten alloy technology, applied in the field of mechanical processing, can solve the problems of low production efficiency and long processing cycle, and achieve the effect of high production efficiency, short processing cycle and uniform cutting force
CN102145403BActive Publication Date: 2013-01-09KONFOONG MATERIALS INTERNATIONAL CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
KONFOONG MATERIALS INTERNATIONAL CO LTD
Publication Date
2013-01-09

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Abstract

The invention discloses a machining method for a tungsten alloy target material, which comprises the steps of providing a semi-finished product of the tungsten alloy target material and carrying out finish machining on the semi-finished product of the tungsten alloy target material, wherein in the finish machining step, the plane of the tungsten alloy target material is machined by a PCBN (Polycrystalline Cubic Boron Nitride) face mill, and the side face of the tungsten alloy target material is machined by a tungsten steel end mill. By adopting the machining method for the tungsten alloy target material provided by the invention, the arris defect in the machining process is avoided, the machining of the tungsten alloy target material with complex curved surface can be realized, and the problems of long machining cycle and low production efficiency are solved.
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Description

technical field

[0001] The invention relates to the technical field of mechanical processing in the semiconductor manufacturing industry, in particular to a milling processing method for a tungsten alloy target. Background technique

[0002] Vacuum sputtering is a process in which electrons accelerate to the substrate under the action of an electric field and collide with argon atoms, ionizing a large number of argon ions and electrons, the electrons fly to the substrate, and the argon ions accelerate to bombard the target under the action of an electric field A large number of target atoms are sputtered out, and the neutral target atoms (or molecules) are deposited on the substrate to form a film, and finally the purpose of coating the substrate surface is achieved.

[0003] Tungsten alloy targets are often used in the process of vacuum sputtering. Mechanical and physical properties of tungsten: Tungsten is a refractory metal with high melting point (up to 3400Β°C), high de...

Claims

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