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Processing method of micro-component in multi-layer structure and solidified SU-8 photoresist sheet

A processing method and multi-layer structure technology, which is applied in the field of micro-machining, can solve the problems of damage to the upper layer pattern, unrealizable, irregular microstructure, etc., and achieve the effect of avoiding damage

Inactive Publication Date: 2011-08-10
TIANJIN SEAGULL WATCH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method will limit the exposure of the next layer and cause damage to the pattern of the previous layer, and cannot achieve irregular microstructures.

Method used

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  • Processing method of micro-component in multi-layer structure and solidified SU-8 photoresist sheet
  • Processing method of micro-component in multi-layer structure and solidified SU-8 photoresist sheet
  • Processing method of micro-component in multi-layer structure and solidified SU-8 photoresist sheet

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Experimental program
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Effect test

Embodiment 1

[0039] Embodiment 1: Now take the manufacture of a micro-component with a three-layer structure as an example for illustration.

[0040] figure 2 It is the UV-LIGA flow chart of the multilayer structure of the present invention; among the figure (a) is uniform glue, (b, e, i) is exposure; (d, h) is pasted and cured SU8 sheet; (c, f, j) (g) is sputtering; (k) is electroforming.

[0041] Such as figure 2 Shown, the processing method of the microcomponent of multilayer structure of the present invention, comprises the following steps:

[0042] (a) Spread the glue on the substrate with the metal seed layer. The speed of the glue is related to the type of glue selected and the required thickness. Take SU82100 as an example, use 1000rpm to evenly glue the glue for 25 seconds, and the thickness of the glue is about 100 microns. After homogenizing the glue, bake the glue on the hot table: first set the temperature of the hot table at 65°C and keep it for 30 minutes, then raise t...

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Abstract

The invention discloses a processing method of a micro-component in a multi-layer structure and a solidified SU-8 photoresist sheet. The method comprises the following steps of: a, homogenizing and drying a photoresist on a substrate of a metal seed layer; b, carrying out ultraviolet exposure on the dried photoresist; c, post-drying and developing the exposed photoresist; d, adhering the solidified SU-8 photoresist sheet; e, exposing the solidified SU-8 photoresist sheet in the step d; f, post-drying and developing the solidified SU-8 photoresist sheet in the step e; g, sputtering the metal seed layer; h, adhering the solidified SU-8 photoresist sheet; i, exposing the solidified SU-8 photoresist sheet in the step h; j, post-drying and developing the solidified SU-8 photoresist sheet in the step i; and k, carrying out electroforming. The method has the advantages that: because the solidified SU-8 photoresist sheet is used, damage to a pattern on a previous layer is avoided, the size of the pattern between two adjacent layers is not limited, and a micro-structure can provide much more convenience for subsequent assembly process.

Description

technical field [0001] The invention relates to the field of micro-processing to manufacture micro-mechanical parts based on UV-LIGA technology, in particular to a processing method for making multi-layer micro-components by curing photoresists. Background technique [0002] Microcomponents with high precision have important applications in the watch industry and in biological microelectromechanical systems (bio-MEMS). Different from the traditional mechanical processing that achieves functions by removing materials, the processing technology based on ultraviolet light deep modeling method (UV-LIGA) is a processing technology that obtains micro components through atomic accumulation. This technology can bring a lot of freedom to the design in the X-Y plane, so as to realize the processing of more complex micro components. In many applications, due to the small size of the micro-components and the difficulty of assembly, there is a need for multi-layer micro-component proces...

Claims

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Application Information

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IPC IPC(8): G03F7/00G03F7/16G03F7/38G03F7/40G03F7/26B81C1/00
Inventor 王英男郭育华江争马广礼
Owner TIANJIN SEAGULL WATCH CO LTD
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