74 results about "SU-8 photoresist" patented technology

The present invention discloses a silicon waveguide spot size converter based on a multilayer polymer structure and a preparation method thereof. The silicon waveguide spot size converter based on themultilayer polymer structure and the preparation method thereof are applied to coupling of silicon nanowire optical waveguides and common single-mode fibers. The structure is made by employing an integrated photoelectron process method, on a silicon substrate on an insulator layer, a taper-type silicon waveguide is made, a lithography technology is employed to continuously nest three layers of combined taper-type optical waveguides with materials of SU-8 photoresist on the insulator layer, and a silicon dioxide upper cladding is deposited to achieve making of a spot size converter. The taper-type portions of the three layers of combined taper-type optical waveguides with materials of SU-8 photoresist are employed to reduce the sizes of spot sizes entering the single-mode fibers in a horizontal direction and a vertical direction, perform cascade with a reverse taper-type silicon waveguide and finally allow a light field to couple into the silicon nanowire optical waveguides. The directend face connection between the silicon nanowire optical waveguides and the common single-mode fibers can be achieved, the matching with the single-mode fiber spot size is improved, the optical coupling efficiency is improved, and it is convenient to perform large-scale optical path integration.

The invention discloses a method for making a self-supporting structure of a nano fluid system based on a SU-8 photoresist, which is characterized by comprising the following steps of: firstly processing and making a PDMS (Polydimethylsiloxane) flexible template, making a SU-8 nano channel substrate by utilizing the PDMS flexible template, simultaneously making a SU-8 bonding layer comprising a sample pond by utilizing ultraviolet exposure development, realizing the bonding sealing of the SU-8 nano channel substrate and the bonding layer by utilizing a bonding technique, and finally removing PDNS and PET (Polyethylene Terephthalate) flexible substrates to obtain the self-supporting structure of the nano fluid system. The method has the advantages of simple operation, low making cost and low equipment requirement. The making result shows that the system has no delamination and blockage, the bonded interface can be hardly seen, and the outline of a channel is clear and visible so that the self-supporting structure of the nano fluid system has good quality.

The invention discloses a polypyrrole microelectrode with three-dimensional structure which belongs to the technical field of the micro-electro-mechanical preparation and is used in the miniature supercapacitor, and a preparation method thereof. The preparation method of the microelectrode comprises the following steps: adopting the MEMS technology to coat a SU-8 epoxy group negative chemically amplified resist on the surface of a copper substrate, performing spin-coating, pre-baking, lithographic process treatment, exposure, post-baking, development, rinsing and heat setting to form a columnar structure which is prepared from SU-8 photoresist and is in an array arrangement, on the surface of the copper substrate, and covering a functional film composed of polypyrrole and conductive material on the surfaces of the copper substrate and the microcolumn array microelectrode. The invention solves the problems that the common polypyrrole electrode with a two-dimensional structure can not store a large quantity of charges, have high internal resistance and the like, thus improving the energy storage characteristic and large current discharge performance of the miniature supercapacitor. The miniature supercapacitor of the invention has wide application prospect in the fields of sensor network node power supply, micro-robot driving power and fuze power.

The microelectromolding metal mold making process belongs to the field of micro machine building technology. The microelectromolding metal mold making process includes the steps of: pre-treatment of mold base, making microelectromolding mother mold, microelectromolding, post-treatment and detection. The present invention adopts so-called 'no-back board growth process', in which micro structure pattern is electromolded directly on nickel substrate via ultraviolet irradiation on photoetching mask. During making microelectromolding mother mold, one seed layer is added between the SU-8 photoresist and the substrate; and in the post-treatment, vacuum annealing is adopted. The microelectromolding metal mold made in the method of the present invention has the merits of high side wall verticality and high surface smoothness. The present invention is suitable for fine machining of organic polymer, including plastic.

The invention discloses a method for preparing high aspect ratio metal microgratings on a metal substrate, and belongs to the micro-manufacturing technical field. A UV-LIGA technology is adopted, the photolithography technological processes such as two-time photoresist homogenizing, layered exposure and one-time developing are executed on a high-purity nickel plate substrate J to obtain an SU-8 photoresist film, and then the metal microgratings can be manufactured through micro electroforming nickel N after micro electroforming treatment; a line width compensating method is used for solving the problem that line width is decreased due to swelling; in the photoresist removing process, a 'ultrasound-soaking-ultrasound-soaking' circulating method is used for removing photoresist; in annealing operation, vacuum annealing is adopted to remove residual stress, and the binding force between the substrate and the metal gratings is improved. The method for preparing high aspect ratio metal microgratings on the metal substrate has the advantages that when the method is used for preparing the metal microgratings on the metal substrate J, the depth-to-width ratio is large, dimensional precision is high, mechanical strength is high, the preparation technology is simple, and cost is low.

The invention discloses a micro-well based gas sensor array and its making method. According to the invention, (1) the gas sensor array adopts an MEMS (Micro-Electro-Mechanical Systems) technology, an interdigital electrode is prepared on an SOI wafer surface, an SU-8 photoresist is used to make a micro-well isolation layer for preventing cross contamination of sensitive materials among different interdigital electrodes during sensitive membrane preparation, and each sensor array at least includes 4 interdigital electrode units; (2) an independent heating unit is located under each interdigital electrode, thus greatly improving the sensitivity and response recovery time of the sensor; (3) an organic membrane, an organic/inorganic composite membrane or an organic-inorganic multilayer membrane is taken as the sensitive membrane, and by determining the resistance change during gas adsorption of the sensitive membrane, qualitative and quantitative detection of a gas can be realized; and (4) using a droplet coating, gas jet or electronic injection technique to prepare the sensitive membrane. The gas sensor array has broad application prospects in the fields of atmospheric environment monitoring, aerospace sealed cabin air quality testing and food security, etc.

A novel approach for fabricating Monolithic Internal micro Pillars (MIPi) made of SU-8 photoresist is described. A microfluidic chip with the internal pillars (a MIPi chip) was used for cell capturing study. The surface of MIPi was coated with specific antibody and then used for capturing cells by affinity binding. An antibody, anti-EGFR, which has high affinity to lung cancer cells, CL1-5, was coated on the micro pillars. The coated MIPi chip specifically captured the cancer cells that were pumped through the MIPi chip. Simulation and experiment was carried out to compare the effect of different geometry of the micro pillars on the cell capturing rate.

The invention discloses a reverse thermal bonding technology for making micro and nano fluid system with controllable size. The technology comprises steps of: coating a pretreated grating template with a layer of SU 8 photoresist; copying a graph to the SU-8 photoresist through a reverse embossing technology; then tearing off the cured SU-8 photoresist by using an adhesive UV tape according to different adhesion among interfaces, so as to successfully transfer the graph to a flexible UV adhesive tape; spinning a thin layer of SU-8 photoresist on another Si sheet to form a sealing layer Si substrate; covering the prepared SU-8 adhesive graphic structure layer on the Si substrate; and preparing the micro and nano fluid system through the reverse bonding technology. The invention combines an embossing technology and a bonding technology together, and has advantages of simple operation, no requirement on high temperature and high pressure, controllable channel size and no clogging; and a low manufacturing cost is conducive to mass production.

A method for preparing a PDMS chip including both square and arc-shaped channels comprises the following steps: clamping an SU-8 male mold of a cross-linked state prepared by standard photolithography with liquid PDMS to obtain a PDMS female mold with an inverted male mold pattern after the PDMS is cured; clamping the female mold PDMS with the solid uncross-linked SU-8 photoresist, heating the photoresist by a vacuum oven to make the photoresist be in a fluid state to fill the PDMS channels to obtain the uncrosslinked SU-8 male mold; selectively exposing the uncrosslinked SU-8 male mold to make the SU-8 male mold partially crosslink to form square protrusion portions; heating the male mold for some time to make the uncrosslinked portions be arc-shaped; performing a fully exposed crosslinking reaction, post-baking, solidifying the mold to get the stereotyped SU-8 square and arc-shaped male mold; and pouring with PDMS, curing, demolding to get the PDMS chip including both square and arc-shaped channels. The chip produced by the present invention is applied to preparation of a micro-fluidic chip liquid channel layer integrated with pneumatic micro-valves. The SU-8 male mold prepared by the invention is not easy to peel off from substrates. The radian of the PDMS chip arc-shaped channel is controllable. The simple and stable method is provided for the preparation of complex chips.

The invention relates to a nuclear magnetic resonance radio-frequency micro-coil, comprising an upper flat subcoil and a lower flat subcoil which are mutually parallel, i.e. a top layer subcoil (2) and a bottom layer subcoil (3). The two flat subcoils have the same shape, and the distance between the subcoils is larger than or equal to the inside radius of the subcoils; the two flat subcoils are connected through a wire; a micro channel (1) used for containing a sample is positioned between and parallel with the top layer subcoil (2) and the bottom layer subcoil (3). An inner through hole (4)is positioned at the joint between the bottom layer subcoil (3) and the top layer subcoil (2); and an outer through hole (5) is positioned at the joint between the top layer subcoil (2) an a second bonding pad (7). The invention can emit radio-frequency pulse signal and (or) receive free induction decay echo signals coming from a tested object. The micro-coil is manufactured based on SU-8 photoresist by utilizing a micro-electro-mechanical system process on a Pyrex substrate (12). The invention can be used for nuclear magnetic resonance test of a nano-liter bio-chemical sample.

The manufacture method for micro-flow injector chemical luminous chip comprises: with silicon piece, PDMS and SU-8 photoresist as material, manufacturing micro-channel and interfaces by standard micro-manufacturing technique; manufacturing mold structure by standard photo-etching technique, using molding cast and solidification technology to prepare the micro-chip structure; finally, irreversible packing the channel. This invention is simple and reliable, and is high sensitive with a little sample.

The invention discloses a processing method of an all metal channel microstructure with great thickness and a high depth-to-width ratio. The processing method comprises the particular technical steps of spin-coating a copper substrate in a set size with a layer of SU-8 photoresist, performing technical procedures such as prebaking, exposing, postbaking, developing, and film upright to form a micro-electroforming female mold, obtaining 1/2 structures by a micro-electroforming and striping technology, and finally, combining the two 1/2 structures into a whole by a pin connection technology. According to the method, the all metal channel microstructure with the great thickness and the high depth-to-width ratio can be obtained by a once gluing technology together with the pin connection technology; the problem in verticality of a side wall caused by exposure and the problem of photoresist residual in a channel caused by incomplete striping when a great thickness glue film is obtained by using the gluing technology for many times are avoided; and a processing bottle neck in the structural thickness and the depth-to-width ratio when the all metal microstructure is prepared by the conventional UV-LIGA (Ultraviolet-Lithographie, Galanoformung and Abformung) technology and the deep reactive ion etching technology are broken through.

The invention discloses a processing method of a micro-component in a multi-layer structure and a solidified SU-8 photoresist sheet. The method comprises the following steps of: a, homogenizing and drying a photoresist on a substrate of a metal seed layer; b, carrying out ultraviolet exposure on the dried photoresist; c, post-drying and developing the exposed photoresist; d, adhering the solidified SU-8 photoresist sheet; e, exposing the solidified SU-8 photoresist sheet in the step d; f, post-drying and developing the solidified SU-8 photoresist sheet in the step e; g, sputtering the metal seed layer; h, adhering the solidified SU-8 photoresist sheet; i, exposing the solidified SU-8 photoresist sheet in the step h; j, post-drying and developing the solidified SU-8 photoresist sheet in the step i; and k, carrying out electroforming. The method has the advantages that: because the solidified SU-8 photoresist sheet is used, damage to a pattern on a previous layer is avoided, the size of the pattern between two adjacent layers is not limited, and a micro-structure can provide much more convenience for subsequent assembly process.

The invention discloses a micromachining method for manufacturing a polymer cylindrical microlens by electric field induction. The method comprises the following steps of: machining on a SiO2 substrate to form a transparent conductive grid structure, spinning an SU-8 photoresist, photoetching and developing a circle of bracket to form a cylindrical electric field contour surface, and evaporating a conductive indium tin oxide (ITO) layer at the bottom of the SiO2 substrate; spinning ultraviolet curing polymer, and pressing a transparent template on the ultraviolet curing polymer to make the bracket made of the SU-8 photoresist pressed into a polymer film; making the conductive grid structure of the plane generate the cylindrical electric field contour surface on the surface of the polymer film by using a direct current power supply, and forming a cylindrical microlens structure; keeping polymer rheology under an electric field with a stabilized voltage value to form the cylindrical microlens structure; and finally, exposing the curing polymer through ultraviolet light, and removing the template to obtain a needed polymer cylindrical microlens array. The method has the advantages of high production efficiency, simple process and low cost.

The invention relates to the technical field of MEMS (Micro Electro Mechanical System), particularly to a preparation method of an SU-8 photoresist-based three-dimensional microelectrode. The method specifically comprises doping nanoscale ferric chloride particles into SU-8 photoresist through a doping method; etching a groove structure with narrow mouth and wide inside in a silicon substrate; spinning the doped SU-8 photoresist onto the silicon substrate with the groove structure; preparing an SU-8 photoresist three-dimensional microelectrode array through the oblique photoetching micromachining technology; carbonizing the electrode array inside a carbonizing device to obtain an SU-8 carbon nanotube; depositing graphene onto the SU-8 carbon nanotube to form an SU-8 carbon nanotube electrode; filing liquid or colloidal electrolyte inside the prepared SU-8 carbon nanotube electrode. According to the preparation method of the SU-8 photoresist-based three-dimensional microelectrode, the aperture of the SU-8 nanotube is controlled and adjusted through the doping method; through combination of the oblique photoetching technology, the specific surface area of the three-dimensional carbon nanotube electrode can be effectively enlarged; compared with traditional capacitor electrode structures, the SU-8 photoresist-based three-dimensional microelectrode greatly improve the energy density and power density of super-capacitors.

The invention discloses a method for manufacturing a micro-nano fluid control system by using a low-pressure bonding technology, which is characterized by comprising the following steps: firstly taking a glass sheet as a substrate to manufacture a KMPR master mask with raster graphics and a PDMS soft stamp; using the PDMS soft stamp to manufacture a raster nano-sized structural Si substrate for manufacturing follow-up nano-channels; using a polyethylene terephthalate (PET) slice to manufacture a PET sheet with double layers of SU-8 photoresist; and manufacturing the micro-nano fluid control system by using the raster nano-sized structural Si substrate and the PET sheet with double layers of SU-8 photoresist. The channels manufactured by the method have the advantages of good uniformity, less possibility of blockage, high success rate, and low manufacturing cost, are flexible in operation and are suitable for large-area production.

The invention belongs to the field of micro-sensors and micro-machining and particularly relates to a miniature electrochemical sensor based on a direct forming mesoporous carbon technology and a manufacturing method. The manufacturing method comprises the steps of using a silicon dioxide layer with 500 nm plasma enhanced chemical vapor deposition thickness as an insulation layer on a silicon wafer and obtaining a working electrode region through photo-etching and etching; obtaining graphs of a counter electrode and a reference electrode substrate region through photo-etching, evaporating 80 nm platinum and then stripping a photoresist; spin-coating an SU-8 photoresist and silicon oxide mixture on a silicon substrate template in the working electrode region, obtaining the working electrode region through photo-etching imaging and using hydrofluoric acid to remove template material silicon dioxide so as to obtain working electrode mesoporous carbon after 900 DEG C high-temperature carbonization; coating silver/silver chloride slurry on reference electrode substrate platinum to obtain solid silver/silver chloride reference electrode.

The invention discloses a method for preparing micro-nano-channels based on a liquid-gas equilibrium polymer nano-channels self-building mechanism. The method comprises the following steps of: first, preparing a nano grating structure of SU-8 photoresist by using a grating template and a nano-imprint lithography technology; then, spin-coating a layer of release agent on the grating structure of the SU-8 photoresist; and finally, coating a layer of SU-8 photoresist on the grating structure of the SU-8 photoresist coated with the release agent by a slit type extrusion gluing way, wherein the micro-nano-channels are formed by a coated SU-8 photoresist layer which is balanced with the air pressure trapped in a grating under the action of surface tension, and the preparation of a micro-nano flow control system is finished. According to the method, high pressure and high temperature are not needed, so that deformation and damage of a polymer grating structure are avoided; processing successrate is improved; and by the method, the sizes of the micro-nano-channels can be controlled by adjusting the surface tension of a polymer.

The invention relates to an ultra-small-size optical fiber temperature sensing probe and a preparation method thereof, and belongs to the technical field of optical fiber sensing. The probe comprises a single-mode optical fiber and an ultra-small-size cuboid sealed liquid cavity. The cuboid sealed liquid cavity is internally provided with an SU-8 photoresist solution. The cuboid sealed liquid cavity is glued to the center of the tail end surface of the single-mode optical fiber, the diameter of an effective sensing area is smaller than 50 micrometers, and the length is smaller than a 30 micrometers. The optical fiber temperature sensing probe is connected with a wide-spectrum light source and a spectrometer through an optical fiber circulator. A Fabry-Perot interference spectrum can be observed on the spectrometer, the movement of an interference peak center wavelength on the spectrum is monitored so as to demodulate the environment temperature, and the temperature sensing sensitivity is higher than 800 pm/ DEG C. The ultra-small-size optical fiber temperature sensing probe has the advantages that the structure is compact and simple, stability and reliability are realized, the temperature-sensitive liquid material is integrated into the optical fiber temperature sensing probe, and the temperature sensing sensitivity is greatly improved. The invention provides the ideal ultra-small-size optical fiber temperature sensing probe and the preparation method thereof which are applicable to the field of temperature sensing detection.

The invention discloses a method for manufacturing a Pt resistor temperature sensor. The method comprises the following steps that firstly, a ceramic substrate is coated with SU-8 photoresist, and a microstructural image is formed based on photolithography; secondly, by the adoption of the magnetron sputtering method, Pt metal is deposited on the ceramic substrate generated after photolithography is completed; thirdly, the ceramic substrate obtained in the second step is ablated in the oxygen atmosphere or placed into a salt bath so that the SU-8 photoresist can be removed; fourthly, a Pt metal microstructural image which is deposited on the ceramic substrate is obtained finally. According to the method for manufacturing the Pt resistor temperature sensor, the characteristic of good heat resistance of the SU-8 photoresist is utilized, the Pt resistor temperature sensor is manufactured by the adoption of the stripping technology, the technology is simple and easy to conduct, and cost is greatly reduced.

The invention discloses a photoelasticity principle based flexile microprobe and an application method thereof. The photoelasticity principle based flexile microprobe, namely an integral structure made of SU-8 photoresist, comprises a microprobe stress end and a microprobe base body. The microprobe base body comprises a base body end and a base body tail. The base body end and the microprobe stress end are arranged on the same side of the base body tail to form a microprobe structure. The light intensity variation of polarized light transmitting a flexible hinge stress measurement area and a measurement light path is measured, a relationship between the light intensity variation and stress magnitude of the microprobe stress end is established, and accordingly, measurement of micro force can be achieved. The photoelasticity principle based flexile microprobe made of the SU-8 photoresist is low in processing technique cost and high in stability and has the advantages of chemical corrosion resistance, good mechanical property and biocompatibility, high light stress coefficient and the like; moreover, the photoelasticity principle based flexile microprobe of the integral structure is free from assembly, simple to produce and beneficial for functionalization of microoperation techniques in the fields of biomedicine, material chemistry and the like.

The invention belongs to the field of micro electromechanical system research, and relates to an approximate ultraviolet exposure and thin film growth method-based method for preparing a nanometer passage. An approximate ultraviolet exposure technology and a reaction ion etching technology are employed, a silicon nanometer die is fabricated, a pattern of the silicon nanometer die is transferred toa SU-8 photoresist die by hot stamping to form a nanometer channel, the channel size is reduced by growing a Parylene thin film to obtain a nanometer channel with a width smaller than 50 nanometers,the package of the nanometer channel is achieved through oxygen plasma auxiliary thermal bonding by a SU-8 photoresist cover plate, and a nanometer passage of which the height and the width both are smaller than 50 nanometers is finally obtained. The method has the characteristics of low cost and high production efficiency and is simple to operate.