Microfluidic chip bonding method using SU-8 photoresist and PDMS as substrates
A microfluidic chip, SU-8 technology, applied in microstructure technology, microstructure device, manufacturing microstructure device and other directions, can solve the problem of difficult bonding between SU-8 substrate and PDMS substrate, expensive and controllable equipment used It can solve problems such as poor stability and poor bonding effect, so as to achieve the effect of mature processing technology, less leakage and high yield
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[0035] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the principle of the present invention.
[0036] see Figure 1~Figure 7 . It should be noted that the diagrams provided in this embodiment are only illustrative to illustrate the basic principles, working process and effects of the present invention, so that only components related to the present invention are shown in the diagrams rather than according to actual implementation The number, formation and dimension drawing of components, the type, quantity and ratio of each...
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