Method for preparing high aspect ratio metal microgratings on metal substrate

A metal substrate, high aspect ratio technology, applied in the direction of diffraction grating, electrolytic process, electroforming, etc., can solve the problems of complex process, inclined grating side wall, high cost, etc., and achieve simple preparation process, high dimensional accuracy, and mechanical strength high effect

Inactive Publication Date: 2014-07-09
DALIAN UNIV OF TECH
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Problems solved by technology

However, the side wall of the grating prepared by this method is inclined, the height is limited, the process is complicated, and the cost is relatively expensive.
I

Method used

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  • Method for preparing high aspect ratio metal microgratings on metal substrate
  • Method for preparing high aspect ratio metal microgratings on metal substrate
  • Method for preparing high aspect ratio metal microgratings on metal substrate

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Embodiment Construction

[0022] The specific implementation manners of the present invention will be described in detail below in combination with the above technical solutions and accompanying drawings.

[0023] For example: high-aspect-ratio metal micro-gratings are prepared on high-purity nickel plates with a nickel content of 99.99%. figure 1 As shown, its comprehensive dimensions are as follows: the width of the grating boss is 65 μm, the length is 900 μm, the height is 243 μm, and the grating period is 130 μm. Nickel plate size is 60×20×3mm 3 , the specific steps for preparing the structure are as follows:

[0024] (1) Substrate pretreatment: Grind and polish on a grinding and polishing machine first, and finally the surface roughness of the nickel substrate reaches below 0.04 μm; then wipe the substrate surface with acetone cotton balls, and then perform ultrasonic cleaning in acetone and ethanol respectively After 10 minutes, rinse with pure water and blow dry, and finally bake in an oven at...

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Abstract

The invention discloses a method for preparing high aspect ratio metal microgratings on a metal substrate, and belongs to the micro-manufacturing technical field. A UV-LIGA technology is adopted, the photolithography technological processes such as two-time photoresist homogenizing, layered exposure and one-time developing are executed on a high-purity nickel plate substrate J to obtain an SU-8 photoresist film, and then the metal microgratings can be manufactured through micro electroforming nickel N after micro electroforming treatment; a line width compensating method is used for solving the problem that line width is decreased due to swelling; in the photoresist removing process, a 'ultrasound-soaking-ultrasound-soaking' circulating method is used for removing photoresist; in annealing operation, vacuum annealing is adopted to remove residual stress, and the binding force between the substrate and the metal gratings is improved. The method for preparing high aspect ratio metal microgratings on the metal substrate has the advantages that when the method is used for preparing the metal microgratings on the metal substrate J, the depth-to-width ratio is large, dimensional precision is high, mechanical strength is high, the preparation technology is simple, and cost is low.

Description

technical field [0001] The invention belongs to the technical field of micro-manufacturing, and relates to metal substrate micro-electroforming metal devices, in particular to a method for preparing a high-aspect-ratio metal micro-grating on a metal substrate based on a UV-LIGA process. Background technique [0002] As one of the core unit devices of optical instruments, metal micro-gratings have important applications in many fields such as spectral measurement, optical computing, and optical information processing. As the demand for metal micro-gratings continues to grow, its processing and preparation methods have attracted more and more attention from researchers. The existing metal micro-gratings are mainly prepared by using silicon as the substrate and combining sputtering, masking layer preparation, etching and other processes. For example, pages 296-298 of the 2010 Proceedings of "Function and Materials" and pages 154-159 of "Journal of Infrared and Millimeter Waves...

Claims

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Application Information

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IPC IPC(8): G02B5/18C25D1/00
Inventor 杜立群赵明鲍其雷谭志成王翱岸
Owner DALIAN UNIV OF TECH
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