Clamp for mixed fracture test of dual-phase material interface

Abstract

The invention belongs to the technical field of a material detection, and particularly relates to a clamp for mixed fracture test of a dual-phase material interface. The clamp is divided into an upper part and a lower part that are symmetric to each other; each of the upper part and the lower part consists of a pulling rod, a semiround plate and a sample table; the sample table is connected with the semiround plate by bolts; the semiround plate is connected with the pulling rod by a bolt; a plurality of round holes are symmetrically arranged at the edge of the semiround plate; and the upper pulling rod and the lower pulling rod are fixedly connected with an upper force-applying system and a lower force-applying system of a pulling machine respectively. The clamp can be used together with a universal mechanic tensile testing machine; a sample with a pre-crack is fixed on the clamp; subsequently the clamp can be rotated so as to apply the pull forces of different angles to the sample; the critical fracture strength of the interface crack can be calculated according to a force-displacement curve. The clamp can be used for conveniently determining the situations of the I-type mixed fracture mode and the II-type mixed fracture mode under different tensile loading angles, and is also applicable to determinine the I-type fracture situation of the dual-phase material interface.

Description

technical field [0001] The invention belongs to the technical field of material detection, and in particular relates to a fixture used for testing the fracture strength of different modes of interfaces of different materials in electronic packaging. Background technique [0002] During the production and testing process of integrated circuit packaging, or when packaged devices work in harsh environments, delamination at the interface of different materials often occurs. For the interface between two materials with a large difference in thermal expansion coefficient (CTE) , stratification is particularly serious. For example, in plastic packaging devices, the thermal expansion coefficient mismatch between PCB, Si, molding compound, resin and other materials is very significant. When the package body is subjected to moisture, heat and other loads, it is easy to Delamination fracture occurs, and the delamination fracture is usually a mixed fracture mode of I and II. The fract...

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Problems solved by technology

However, for the interface in the aforementioned electronic packaging device, the thickness of the material is very thin, and it involves brittle materials such as Si, which is not suitable for the experiment of bending mode, and it is not easy to prepare the semicircular sample required by the Brazil-nut compression method; On the one hand, the change range of the fracture phase angle of the bending method and the wedge-shaped insertion method is very small, and the law of the change of the fracture energy with the fracture phase angle cannot be obtained in a large range.

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