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Probe station device

A technology of probe station and probe, which is applied in the direction of measuring devices, instruments, measuring electronics, etc., can solve problems such as multi-layer printed circuit boards, flexible cable congestion, and difficulty in determining the position accuracy of connection parts

Inactive Publication Date: 2011-08-24
木本军生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, as shown in Japanese Patent Laid-Open No. 2003-075503, in the line arrangement connection method of connecting only one end of the flexible flat cable, in order to cope with further narrow pitch, multi-pin (pin) or different semiconductor circuit electrode blocks Arrangement, it will be difficult to package due to the congestion of flexible cables, and it is difficult to determine the position accuracy of the connection part
[0007] In addition, as shown in Japanese Patent Laid-Open No. 2007-279009, in the method of connecting the output terminals from the probe assembly only on the surface layer of the printed circuit board, in order to further respond to the narrow pitch, multilayer printed circuit Problems with boards, large resin film probes

Method used

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Embodiment Construction

[0081] The following is a detailed description of the embodiments of the present invention with reference to the drawings; figure 1 It is a diagram of the first embodiment of the present invention, and it is an oblique view of the general structure of the probe station device; figure 2 for configuration in figure 1 Detailed cross-sectional view of the probe assembly in the central part of the probe station device shown; image 3 and Figure 4 Constituting a diagram for the probe assembly; Figure 5 for figure 1 Front view of central part; Image 6 It is a cross-sectional view of the fixed positional relationship between the probe assembly, the wiring circuit board, and the common circuit board.

[0082] figure 1 and figure 2 The probe station device shown is composed of the following parts; 1 is a probe assembly, 2 is an LSI electrode block for signal input and output arranged on a wafer or other electronic equipment to be tested, 3 is a wiring circuit board, 4 is a ...

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PUM

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Abstract

The invention relates to a probe assembly which can be easily connected to be assembled at a narrow spacing, and a printed circuit board for maintaining the sparse spacing, so a probe is contacted with a semiconductor chip to be inspected; a probe station device for performing electrical connection between inspection devices via the probe is provided with an output terminal connected with the probe directly; while a plurality of probe groups containing the output terminal are regularly arranged to form a plurality of layers of integrated probe assemblies, and a wiring circuit board with a wiring is attached to the surface of a non-conductive glue film; after a welding pad arrangement group at one end of the nth layer of the wiring circuit board is contacted with the nth line of the output terminal of the probe assembly, a wiring terminal formed at the other end of the wiring circuit board is connected to the inspection device wiring circuit board or a terminal connector so as to construct the semiconductor chip to be inspected and the inspection device, which are electrically connected with each other.

Description

technical field [0001] The present invention relates to a probe assembly of a probe station device for inspecting several semiconductor chip circuits formed on a semiconductor wafer in the manufacturing process of electronic equipment such as LSI; especially related to the circuit terminals arranged on the semiconductor chip (Electrode block (pad)), which contacts the probes in the wafer state, and is used as a probe station device for coordinating the probe test (probing test) for measuring the electrical conduction of semiconductor chips. Background technique [0002] With the progress of semiconductor technology, the integration of electronic equipment has been improved, and the number of circuit terminals (electrode blocks) on each semiconductor chip has been increased, and the area of ​​electrode blocks has been reduced accordingly, and the spacing between electrode blocks has been narrowed. Let the arrangement of electrode blocks develop toward miniaturization. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
Inventor 木本军生
Owner 木本军生