Process for assembling radio frequency power amplifier circuit board

A radio frequency power amplifier and assembly process technology, which is applied in the direction of assembling printed circuits with electrical components, printed circuits, and printed circuit manufacturing, and can solve problems such as heat dissipation and grounding performance degradation.

Active Publication Date: 2011-08-24
WUHAN GEWEI ELECTRONICS TECH
View PDF3 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to enhance the heat dissipation effect of the power amplifier, the current industry mainly adopts direct soldering of components on the PCB, and then fixes the PCBA (Printed Circuit Board Assembly, PCB component) component on the heat dissipation bottom plate or cavity by lo

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Process for assembling radio frequency power amplifier circuit board
  • Process for assembling radio frequency power amplifier circuit board
  • Process for assembling radio frequency power amplifier circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] In order to facilitate a further understanding of the process and achieved effects of the present invention, preferred embodiments are described in detail below in conjunction with the accompanying drawings.

[0048] Such as figure 1 As shown, the assembly process of a kind of radio frequency power amplifier circuit board of the present invention comprises the following steps:

[0049] Technology of the present invention is implemented according to the following steps:

[0050] S1: Design the stencil template. In this invention, three stencils are required, which are the reverse stencil, the front stencil and the thermally conductive silicone grease coated stencil. The reverse stencil meets the requirement of brushing solder paste on the reverse side of the PCB, and the front stencil satisfies the copper plate and PCB. At the same time, brush the solder paste through the tooling, and apply a thermally conductive silicone grease to the steel mesh to meet the requirement...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a process for assembling a radio frequency power amplifier circuit board, which comprises the following steps: designing a steel mesh template, a printing assembly, a pressing assembly and a copper plate positioning assembly in order to meet the chip-mounting production; before performing the chip-mounting, roasting the tide sensitive devices such as a power amplifier tube and a PCB (printed circuit board) circuit board according to the tide sensitive control rule; brushing solder paste on the back side of the PCB while brushing solder paste (containing the solder paste used for soldering the power amplifier tube ) on the PCB and copper plate through the assembly; using a chip-mounting machine to mount the chip on the surface chip-mounting devices (including mounting on the power amplifier tube); manually inserting a THT (through hole technology) connector on the PCB circuit board mounted with the device; and lastly loading the PCB and the copper plate into an assembly backflow furnace. By using the process for assembling a radio frequency power amplifier circuit board provided by the invention, the excellent power amplifier radio frequency radiation and grounding properties are ensured, the reliability and the service life of the power amplifier are increased, and the product cost is lowered by adding the copper plate in the last stage.

Description

technical field [0001] The invention relates to an assembly process of a radio frequency power amplifier circuit board, in particular to an assembly process of a radio frequency power amplifier circuit board with good heat dissipation effect. Background technique [0002] RF power amplifiers are developing in the direction of high power and low cost. As the output power required by RF power amplifiers increases, its heat dissipation design is particularly important, because the heat dissipation effect of power amplifiers directly affects the reliability of power amplifiers. stability, and its performance indicators. In order to enhance the heat dissipation effect of the power amplifier, the current industry mainly adopts direct soldering of components on the PCB, and then fixes the PCBA (Printed Circuit Board Assembly, PCB component) component on the heat dissipation bottom plate or cavity by locking screws, so that the final circuit And the power amplifier tube is directly...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/00H05K3/34
Inventor 孟庆南
Owner WUHAN GEWEI ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap