Process for assembling radio frequency power amplifier circuit board

Abstract

The invention discloses a process for assembling a radio frequency power amplifier circuit board, which comprises the following steps: designing a steel mesh template, a printing assembly, a pressing assembly and a copper plate positioning assembly in order to meet the chip-mounting production; before performing the chip-mounting, roasting the tide sensitive devices such as a power amplifier tube and a PCB (printed circuit board) circuit board according to the tide sensitive control rule; brushing solder paste on the back side of the PCB while brushing solder paste (containing the solder paste used for soldering the power amplifier tube ) on the PCB and copper plate through the assembly; using a chip-mounting machine to mount the chip on the surface chip-mounting devices (including mounting on the power amplifier tube); manually inserting a THT (through hole technology) connector on the PCB circuit board mounted with the device; and lastly loading the PCB and the copper plate into an assembly backflow furnace. By using the process for assembling a radio frequency power amplifier circuit board provided by the invention, the excellent power amplifier radio frequency radiation and grounding properties are ensured, the reliability and the service life of the power amplifier are increased, and the product cost is lowered by adding the copper plate in the last stage.

Description

technical field [0001] The invention relates to an assembly process of a radio frequency power amplifier circuit board, in particular to an assembly process of a radio frequency power amplifier circuit board with good heat dissipation effect. Background technique [0002] RF power amplifiers are developing in the direction of high power and low cost. As the output power required by RF power amplifiers increases, its heat dissipation design is particularly important, because the heat dissipation effect of power amplifiers directly affects the reliability of power amplifiers. stability, and its performance indicators. In order to enhance the heat dissipation effect of the power amplifier, the current industry mainly adopts direct soldering of components on the PCB, and then fixes the PCBA (Printed Circuit Board Assembly, PCB component) component on the heat dissipation bottom plate or cavity by locking screws, so that the final circuit And the power amplifier tube is directly...

AI Technical Summary

Problems solved by technology

In order to enhance the heat dissipation effect of the power amplifier, the current industry mainly adopts direct soldering of components on the PCB, and then fixes the PCBA (Printed Circuit Board Assembly, PCB component) component on the heat dissipation bottom plate or cavity by locking screws, so that the final circuit and the power amplifier tube are directly locked on the bottom plate or the heat dissipation cavity by screws, and the heat dissipation and grounding are realized by screws, and the heat dissipation and grounding performance are greatly reduced

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