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Electronic circuit board moistureproof process

An electronic circuit board and process technology, which is applied to the secondary treatment of printed circuits and the application of non-metallic protective layers. The effect of parameter guarantees

Inactive Publication Date: 2011-09-21
苏州工业园区非而智能电器有限公司
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Problems solved by technology

[0004] But the main shortcoming of the moisture-proof technology of the electronic circuit board of prior art is: (1), when the electronic circuit board carries out surface drying, can not guarantee that it fully dries thoroughly
(2) Painting the surface of the circuit board cannot guarantee that all aspects are taken care of, and the surface is completely treated to

Method used

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Embodiment Construction

[0017] In order to have a further understanding and understanding of the structural features of the present invention and the achieved effects, the preferred embodiments and accompanying drawings are used for a detailed description, as follows:

[0018] figure 1 It is a flow chart of the electronic circuit board moisture-proof process of the present invention, as shown in the figure. The electronic circuit board moisture-proof process of the present invention comprises the following steps:

[0019] Step S1, cleaning the surface of the electronic circuit board, including cleaning oil mist, dust and metal powder on the surface of the electronic circuit board.

[0020] Oil mist, dust and metal powder on the surface of the electronic circuit board can easily cause a decrease in the insulation resistance between components, and even cause damage to components and electronic circuit boards.

[0021] In step S2, the electronic circuit board is dried in a high-temperature drying ove...

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Abstract

The invention relates to an electronic circuit board moistureproof process which comprises the following steps of: a. carrying out cleaning treatment on the surface of an electronic circuit board; b. drying the electronic circuit board through a high-temperature drying oven; and c. carrying out paint immersion treatment on the electronic circuit board twice. By adopting the electronic circuit board moistureproof process disclosed by the invention, the problem that the surface treated electronic circuit board can not be completely dried can be solved, and by adopting the two-step paint immersion process, an electronic component on the electronic circuit board can completely prevent from moisture and is protected, and performance parameters of all components are favorably guaranteed.

Description

technical field [0001] The invention relates to electronic circuit boards, in particular to a moisture-proof technology for electronic circuit boards. Background technique [0002] The harm of moisture to the semiconductor industry is mainly manifested in the fact that moisture can penetrate the IC plastic package and invade the interior of the IC from the gaps such as pins, resulting in IC moisture absorption. Water vapor is formed during the heating process of the SMT process, and the resulting pressure causes cracks in the IC resin package and oxidizes the metal inside the IC device, resulting in product failure. In addition, when the device is soldered on the PCB, due to the release of water vapor pressure, it will also lead to false soldering. According to the IPC-M190J-STD-033 standard, SMD components exposed to high-humidity air must be placed in a dry box with a humidity below 10% RH for 10 times the exposure time in order to restore the "workshop life" of the compo...

Claims

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Application Information

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IPC IPC(8): H05K3/22H05K3/28
Inventor 霍利娜
Owner 苏州工业园区非而智能电器有限公司
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