Low-modulus optical fiber sensing probe for testing internal stress of flexible road structure
An optical fiber sensing probe, road structure technology, applied in measurement devices, optical devices, instruments, etc., can solve the problems of difficult matrix strain coordination, high stiffness of pavement structure, poor shear resistance, etc., to improve cooperative deformation ability, Enhances bonding and ensures consistency
Inactive Publication Date: 2011-10-12
DALIAN UNIV OF TECH
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Problems solved by technology
However, due to the poor shear resistance of the optical fiber material (SiO2), it is not suitable for extensive deployment and harsh service environments, so packaging technology must be used to lay it in the pavement structure
The previous encapsulation method still has the problem of excessive rigidity when used in pavement structures, and it is difficult to achieve coordination with the substrate strain
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[0016] The specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings.
[0017] (1) The structure of the sensing probe
[0018] The structure of the sensor probe in the present invention is shown in Figure 1, and mainly consists of four parts: 1 low modulus packaging layer, 2 optical fiber clamping, 3 bare optical fiber or fiber resin material flexible packaging optical fiber sensitive element and 4 test jumper. The optical fiber sensitive element is the strain sensing and measuring element of the sensing probe, which can be a fiber grating that can accurately measure local strain, or a Brillouin distributed optical fiber that detects global strain distribution. The optical fiber clamping part uses FRP or shape memory alloy to expand the end of the small-diameter optical fiber. The optimized size through finite element calculation can ensure that the strain of the optical fiber and the p...
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The invention discloses a low-modulus optical fiber sensing probe for testing internal stress of a flexible road structure and belongs to the technical field of road structure stress tests. The probe is characterized in that: a small-diameter optical fiber sensitive element is subjected to end expansion through a clamping material, so that relative displacement is not generated between the optical fiber sensitive element and the clamping material, and the corresponding dimension is simulated and optimized through a finite element; and the optical fiber sensitive element is packaged by a modulus adjustable flexible packaging material, so that the optical fiber sensitive element is in stress coordination with a matrix, and the dimension is simulated and optimized through the finite element. The invention has the advantages that: the probe can be laid in the process of laying a hot mix asphalt concrete pavement, and cannot be damaged in the pavement compaction process; the deformation of the optical fiber sensitive element is consistent with that of the packaging material; and the sensing probe does not influence an internal stress field of the pavement and can guarantee cooperative deformation of a sensor and a pavement structure.
Description
technical field [0001] The invention belongs to the technical field of road surface structure stress testing, and is a low-modulus packaged optical fiber sensing probe that does not affect the internal stress distribution of the pavement structure, and can realize cooperative deformation with the pavement structure and accurately test the internal stress of the flexible road structure. Background technique [0002] For roads, especially expressways, construction and long-term service performance are related to driving safety. Accurately grasping the internal stress of pavement structures during service is the most important means to understand the performance of pavement structures. Flexible pavement, such as asphalt concrete pavement, accounts for a large proportion of various road forms in our country. Due to the inhomogeneity of the material composition of each layer (even the same layer), the parameter uncertainty caused by environmental influences, the low modulus of th...
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IPC IPC(8): G01B11/16
Inventor 周智刘婉秋王花平何建平黄明华
Owner DALIAN UNIV OF TECH