High-entropy alloy powder conductive polymer composite material and manufacturing method thereof

A technology of conductive polymer and high-entropy alloy, which is applied to conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of high price, low price and high resistivity of silver powder, and achieve good wettability and low cost. Effect

Inactive Publication Date: 2011-10-19
黄元盛
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver powder conductive polymer composite material has good electrical conductivity, but the price of silver powder is high, and the price of metal powder such as copper powder and aluminum powder is low, but its oxidation resistance is poor.
Graphite powder is stable a

Method used

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  • High-entropy alloy powder conductive polymer composite material and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] Prepare the high-entropy alloy powder conductive polymer composite material according to the following formula in parts by weight:

[0015] Al 0.5 CoCrCuFeNiTi high entropy alloy powder 20

[0016] SBR 80

[0017] Preparation method: Al 0.5 CoCrCuFeNiTi high-entropy alloy powder and styrene-butadiene rubber are mixed, mixed in an internal mixer, and granulated. The obtained sample was pressed into a film at 220°C, and the resistivity of the sample was measured by a four-point probe method. The values ​​are shown in Table 1.

Embodiment 2 to 10

[0019] The manufacturing steps of Example 1 were repeated, but the constituent elements of the high-entropy alloy powder conductive filler and the polymer material were changed to the compositions shown in the conductive polymer composite material numbers 2 to 10 in Table 1. The resistivity test method is the same as in Example 1, and the values ​​are shown in Table 1.

[0020] Table 1 Composition of conductive polymer composite material (weight ratio of high-entropy alloy powder conductive filler to polymer material is 1:4)

[0021]

[0022] In summary, high-entropy alloy powder is a very good conductive filler, which has excellent compatibility with polymer materials. The high-entropy alloy powder conductive polymer composite material of the invention has the characteristics of stability and low cost.

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Abstract

The invention relates to a high-entropy alloy powder conductive polymer composite material and a manufacturing method thereof. The high-entropy alloy powder conductive polymer composite material is characterized by being prepared from a multi-component high-entropy alloy powder conductive filling material and a polymer material; the conductive filling material contains five to ten kinds of primary metallic elements and each one of the primary metallic elements accounts for 5 to 30 atomic percentage of the conductive filling material; and the polymer material is a natural rubber or a synthetic polymer material. The high-entropy alloy powder conductive polymer composite material has the advantages of stabilization, oxidation resistance and low cost.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing a conductive polymer composite material, in particular to a high-entropy alloy powder conductive polymer composite material obtained by mixing, melting and kneading a high-entropy alloy powder and various high-molecular polymer materials and its production method. 【Background technique】 [0002] Conductive composite materials currently mainly refer to composite conductive polymer materials. For a long time, polymer materials are usually widely used as insulating materials in the electrical industry, installation engineering, communication engineering, etc. However, due to the poor electrical conductivity of the material, there have been some urgent problems to be solved in the processing and application, the most prominent is the electrostatic phenomenon, which will lead to the decline of the performance of the photosensitive film and cause disasters in the flammable and explosive occasions of poly...

Claims

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Application Information

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IPC IPC(8): C08L101/00C08K3/08H01B1/22
Inventor 黄元盛
Owner 黄元盛
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