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Method for encapsulating white light LED (Light Emitting Diode) display module

A technology of display module and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high production cost of white LED display module, large amount of packaging glue, phosphor powder, and high phosphor powder price, and can achieve mass production. The effect of good chemical production consistency, reduced phosphor powder consumption, and simple operation process

Active Publication Date: 2012-12-19
JIANGSU WENRUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing packaging methods for LED display modules have the disadvantages of using a large amount of packaging glue and phosphor powder, and the price of phosphor powder is high, resulting in high production costs for white light LED display modules, which affects its market expansion.

Method used

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  • Method for encapsulating white light LED (Light Emitting Diode) display module
  • Method for encapsulating white light LED (Light Emitting Diode) display module
  • Method for encapsulating white light LED (Light Emitting Diode) display module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 , figure 2 As shown, the steps of Embodiment 1 of the present invention are as follows:

[0032] 1) Mix 99%~99.5% epoxy resin or silica gel with 0.5%~1% fluorescent powder and stir evenly to prepare fluorescent glue.

[0033] 2) The fluorescent glue is injected into each reflective pen section 11 of the reflective cavity 1 by dispensing glue or potting method to form the first encapsulating layer 2 of fluorescent glue with a thickness of 1 / 4-1 / 6 of the height of the reflective pen section 11 .

[0034] 3) Baking and curing the fluorescent glue encapsulation layer 2 at low temperature, baking temperature: 60°C-80°C, baking time: 1-2 hours.

[0035] 4) Mix and stir the epoxy resins of components A and B evenly and inject them into the reflective pen segments 11 of the reflective cavity 1 to completely cover the fluorescent glue encapsulation layer 2 to form the second epoxy resin encapsulation layer 3 .

[0036] 5) Insert the circuit board 5 of the LE...

Embodiment 2

[0039] Such as image 3 , Figure 4 As shown, the steps of Embodiment 2 of the present invention are as follows:

[0040] 1) The bottom of the reflective cavity 1 is turned upside down, and epoxy resin or silica gel is injected into the reflective pen segments 11 of the reflective cavity 1 by dispensing or potting to form the first encapsulation layer 6 with a thickness of 11 2 / 3~5 / 6 of the height.

[0041] 2) Baking and curing the first encapsulation layer 6 at a low temperature, the baking temperature: 60°C-80°C, and the baking time: 1-2 hours.

[0042] 3) Mix 99%~99.5% epoxy resin or silica gel with 0.5%~1% fluorescent powder and stir evenly to make fluorescent glue.

[0043] 4) The fluorescent glue is injected into each reflective pen segment 11 of the reflective cavity 1 to completely cover the first encapsulation layer 6 to form the second encapsulation layer 7 .

[0044] 5) Insert the circuit board 5 of the LED blue light chip 4 that has been solidified and wire-bon...

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Abstract

The invention discloses a method for encapsulating a white light LED (Light Emitting Diode) display module, comprising the following steps of: 1) preparing fluorescent gum; 2) injecting the fluorescent gum into a reflective cavity to form a first fluorescent gum encapsulating layer; 3) baking and curing the fluorescent gum encapsulating layer; 4) injecting epoxy resin into the reflective cavity to cover the fluorescent gum encapsulating layer so as to form a second epoxy resin encapsulating layer; 5) reversely inserting a bonding surface of an blue light LED chip circuit board downwards into the reflective cavity so as to enable a non-bonding surface of the circuit board to be covered by the epoxy resin; 6) and baking the second epoxy resin encapsulating layer at low temperature. Through another method for encapsulating a white light LED display module disclosed by the invention, a first encapsulating layer, a second encapsulating layer and a third encapsulating layer can be formed. The method reduces more than 30% of fluorescent powder and reduces the production cost of the white light LED display module; and the method has good consistence of batch production and is simple in operating technology.

Description

technical field [0001] The invention relates to a manufacturing method of a white light LED display module, in particular to a multiple packaging method of the white light LED display module, belonging to the technical field of LED light sources. Background technique [0002] LED light-emitting diode is a solid-state semiconductor device that can directly convert electricity into light. Multiple LED light-emitting diodes are combined into a display module in the form of a dot matrix. The white LED display module has the advantages of high luminous efficiency, good light color, low heat generation, and low energy consumption. It is developing rapidly as a new generation of light sources to gradually replace the existing ones. Fluorescent lamps, energy-saving lamps. [0003] The packaging method of the existing white light LED display module is as follows: use epoxy resin mixed with phosphor as the packaging glue and inject it into the horn-shaped reflective pen section of RE...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 田皓鹏赵强
Owner JIANGSU WENRUN OPTOELECTRONICS