Multiple-photoelectric thin board spliced yin and yang jig
A thin plate and photoelectric technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of SMT increasing the input cost of wires and manpower, the placement equipment cannot be placed stably, and the CT imbalance of SMT wires, etc., to improve SMT process integration speed and process quality, reduce labor intensity and production costs, and avoid deformation effects
Inactive Publication Date: 2011-10-19
昆山元崧电子科技有限公司
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Problems solved by technology
[0004]a. If the number of unit points is small, the CT of the SMT wire body will be seriously unbalanced, and the output cannot be maximized;
[0005]b. Front and back connecting boards will cause SMT to increase input costs such as line body and manpower;
[0006]c. The thinning of PCB is a great test for the quality of the process, and the quality problems derived include PCB deformation,
[0007] The placement equipment cannot be placed stably, etc.
Method used
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[0018] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0019] see figure 1 and figure 2 , the photoelectric thin plate multiple yin and yang fixture of this embodiment includes a treatment body, the material of the treatment body 1 is aluminum alloy or synthetic stone, T=3-5mm, and the treatment body 1 of the aluminum alloy material is used in this embodiment. After the production is completed, hard oxidation treatment is required.
[0020] A plurality of integrated single boards 2 for integrating PCB boards in the SMT process are spliced on the fixture body 1, and a number of expansion pins 4 for fixing the PCB boards are arranged on the periphery of the integrated single boards 2, which are aligned with the positioning holes at the four corners of the PCB board. Adapt accordingly to ensure that...
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The invention relates to a multiple-photoelectric thin board spliced yin and yang jig, comprising a jig body. A plurality of integration single boards used for integrating printed circuit boards (PCBs) by a surface mount technology (SMT) process are arranged on the jig body; expansion pin bolts used for fixing the PCBs on the periphery of the integration single boards; a plurality of windows which are arranged in order and need to be milled are arranged on the integration single boards; and a track used for transmission is arranged on the side of the bottom of the jig. By utilizing the jig provided by the invention, a plurality of integration single boards are spliced into a whole in the SMT process, namely that the traditional single board production manner is changed into a multiple connection board or board splicing production manner, thus the SMT can reach higher equipment level, and is convenient in use; and the integration speed of the SMT process and the process quality of small-sized high-precision photoelectric thin boards are improved; through arranging the track and the expansion pin bolt, the jig body moves through a sliding track, and adapts to different shapes of thePCBs, thus achieving the purpose of fixing the PCBs, avoiding the PCB deforming, reducing the labor intensity of workers and the production cost, and improving the output and the production efficiency of the enterprises.
Description
technical field [0001] The present invention relates to the SMT process integration of small-sized high-precision photoelectric thin plates, and specifically relates to a small-sized high-precision photoelectric thin-plate multiple yin-yang jig. Background technique [0002] With the trend of miniaturization and high intelligence of electronic products, the SMT process has also entered the period of high precision, high density and small size. When the existing SMT process of PCB board is integrated, it is produced by the traditional single board fixture, which is characterized by the unit The number of dots is small, the front and back are connected, and the thickness of most PCBs is less than 1.0mm. [0003] However, due to the influence of existing product characteristics, there are following defects: [0004] a. The number of unit points is small, and the CT of the SMT wire body will be seriously unbalanced, and the output cannot be maximized; [0005] b. Front and bac...
Claims
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IPC IPC(8): H05K3/30
Inventor 李忠进
Owner 昆山元崧电子科技有限公司