Gas distribution apparatus, and substrate-processing apparatus comprising same

A gas distribution plate and gas distribution technology, applied in the directions of liquid injection devices, injection devices, electrical components, etc., can solve the problems of reducing film deposition speed, reducing, increasing maintenance and repair costs, etc., to reduce the use of processing gas, Ease of manufacture, effect of improving thin film deposition efficiency

Inactive Publication Date: 2011-11-09
JUSUNG ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when tubes are coupled using a brazing process, the failure rate may increase
In addition, the brazing process may be repeated to cause thermal distortion and stresses inherent in the brazed part causing leaks
[0005] In addition, the decomposition efficiency may be reduced due to the decomposition temperature difference between the various processing gases, or the processing gas may be decomposed before the processing gas is injected into the processing chamber
As a result, the film deposition rate may be reduced and the uniformity of the film may be deteriorated
In addition, increased processing gas usage increases processing costs
Moreover, the increase in the amount of by-products increases maintenance and repair costs

Method used

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  • Gas distribution apparatus, and substrate-processing apparatus comprising same
  • Gas distribution apparatus, and substrate-processing apparatus comprising same
  • Gas distribution apparatus, and substrate-processing apparatus comprising same

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Embodiment Construction

[0062] The exemplary embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings.

[0063] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numbers refer to like elements throughout.

[0064] figure 1 is a cross-sectional view of a substrate processing apparatus according to an exemplary embodiment, figure 2 and image 3 A detailed cross-sectional view and an exploded perspective view illustrating a gas distribution device of a substrate processing apparatus according to an exemplary embodiment, respectively. Figure 4 A to Figur...

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Abstract

The present invention relates to a gas distribution apparatus, and to a substrate-processing apparatus comprising same. The present invention provides a gas distribution apparatus comprising: a first gas distribution unit which sprays at least two process gases over a substrate through different routes; and a second gas distribution unit which sprays process gas, having a decomposition temperature higher than the average of the decomposition temperatures of said at least two process gases, over the substrate. The first gas distribution unit is divided into at least two subunits which are arranged about the second gas distribution unit, and which can be combined together or separated from each other. The present invention also provides a substrate-processing apparatus comprising the gas distribution apparatus.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus including a gas distribution device configured to supply source materials containing two or more elements. Background technique [0002] Generally, in order to manufacture semiconductor devices, display devices, and thin-film solar cells, a thin-film deposition process for depositing a thin film of a specific material on a substrate, photolithography for exposing or covering a selected area of ​​a thin film using a photoresist process and an etch process for removing and patterning thin films in selected areas. Among these processes, the thin film deposition process and the etching process are performed in an optimized substrate processing apparatus in a vacuum state. [0003] In a substrate processing apparatus, a gas distribution device is used to uniformly distribute processing gas in a processing chamber having a reaction s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/205B05B7/08
Inventor 崔善弘李承浩李永熙
Owner JUSUNG ENG
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