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Electroless palladium plating solution and method of use

A technology of electroless plating and plating solution, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., and can solve problems such as difficult pattern drawing of palladium

Inactive Publication Date: 2011-11-16
OMG AMERICAS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, palladium-containing patterning is not easily performed using vapor deposition methods

Method used

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  • Electroless palladium plating solution and method of use
  • Electroless palladium plating solution and method of use
  • Electroless palladium plating solution and method of use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041]

[0042]

Embodiment 2

[0044] Acid cleaning baths having the following composition are used to clean metal surfaces of articles:

[0045]

[0046] In preparing metal surfaces of articles such as copper coupons, printed circuit boards, or electronic components, for palladium deposition, the article may be subjected to an acid cleaning bath to remove contaminants from the metal surface. The acid cleaning bath may be agitated mechanically or ultrasonically to facilitate the cleaning process.

Embodiment 3

[0048] A microetching bath having the following composition was used to etch the metal surface of the article:

[0049]

[0050]

[0051] The use of sulfur peroxide in acid cleaner baths has been shown to improve the appearance of metal surfaces of plated articles.

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Abstract

An electroless palladium plating solution includes a polar solvent, at least one palladium salt, at least one non-nitrogenated complexing agent, an alkaline adjusting agent that adjusts the plating solution to a pH of at least 8.0, and a reducing agent. The plating solution, which is used for forming a layer of palladium on a surface of a substrate, yields a substantially pure palladium deposit on the substrate. Precipitation of reduced palladium in the plating solution is substantially prevented.

Description

[0001] Cross References to Related Applications [0002] This International Patent Application claims priority to and benefit of US Provisional Application No. 61 / 120,127, filed December 5, 2008, which is incorporated herein by reference. technical field [0003] The invention relates to an electroless plating solution and a method for using the same. More specifically, the present invention relates to an electroless palladium plating solution and method of use thereof. Background of the invention [0004] The base metal may be protected against corrosion by aggressive gases or liquids by a corrosion-resistant metal film, the type of corrosion-resistant metal film being essentially determined by the intended use of the article. For example in welding wire, iron / steel is protected from rust by a thin copper film deposited on it. In the electronics industry, gold is often used to coat surfaces to be bonded or soldered or for electrical contact. Silver is generally not used ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/52C23C18/31C23C18/54
CPCC23C18/1831C23C18/1658C23C18/24C23C18/44C23C18/52C23C18/31C23C18/54
Inventor A·M·皮亚诺J·特雷诺尔
Owner OMG AMERICAS INC
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