Wafer-level image sensor module structure with specific focal length and manufacturing method thereof

A technology of image sensor and module structure, applied in image communication, radiation control device, parts of color TV, etc. Improve product yield and prevent stray light

Inactive Publication Date: 2011-11-30
KINGPAK TECH INC
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  • Abstract
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  • Claims
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Problems solved by technology

[0006] It can be seen that the above-mentioned existing image sensor module structure and its manufacturing method obviously still have inconvenience and defects in product structure, method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manu

Method used

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  • Wafer-level image sensor module structure with specific focal length and manufacturing method thereof
  • Wafer-level image sensor module structure with specific focal length and manufacturing method thereof
  • Wafer-level image sensor module structure with specific focal length and manufacturing method thereof

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[0056] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the structure of the wafer-level image sensor module with a specific focal length and its The specific implementation, method, steps, structure, characteristics and effects of the manufacturing method are described in detail below.

[0057] The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiment with reference to the drawings. Through the description of the specific embodiments, it is possible to obtain a more in-depth and specific understanding of the technical means and effects adopted by the present invention to achieve the predetermined purpose. However, the accompanying drawings are only for reference and explanation purposes, and are not us...

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Abstract

The invention relates to a wafer-level image sensor module structure with a specific focal length and a manufacturing method thereof. The manufacturing method is to provide a silicon wafer including a plurality of image sensing chips with photosensitive regions, and provide a lens group wafer including a plurality of wafer-level lens groups with a specific focal length, and then use these image sensing Chips and wafer-level lens groups are graded and screened according to different qualities, and each wafer-level lens group is assigned to be set on each image sensing chip of the same level according to the quality graded and screened results, and each wafer-level lens is The group is aligned with the photosensitive area of ​​each image sensing chip, and finally packaged so that the packaging glue covers the surroundings of the wafer-level lens group.

Description

technical field [0001] The present invention relates to a manufacturing method and structure of an image sensor module, in particular to a wafer-level image sensor module structure with a specific focal length that is applied to reduce the height of the image sensor module and simplify the manufacturing process and its method of manufacture. Background technique [0002] A conventional camera module includes an image sensor, an IR filter, a lens, and a holder for holding these components. Among them, the image sensor is a semiconductor device used to capture images of objects, and can be applied to various electronic products such as digital cameras (DSC), digital video cameras (DV), security monitoring, mobile phones, and vehicle image sensor modules. However, in order to meet the needs of various electronic products that need to be thin, light and small, and can be mass-manufactured, it is necessary to effectively simplify the manufacturing process and reduce the size of ...

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Application Information

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IPC IPC(8): H01L27/146H04N5/225
Inventor 杜修文陈翰星辛宗宪陈明辉
Owner KINGPAK TECH INC
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