Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer-level image sensor module structure with specific focal length and manufacturing method thereof

A technology of image sensor and module structure, applied in image communication, radiation control device, parts of color TV, etc. Improve product yield and prevent stray light

Inactive Publication Date: 2011-11-30
KINGPAK TECH INC
View PDF4 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It can be seen that the above-mentioned existing image sensor module structure and its manufacturing method obviously still have inconvenience and defects in product structure, method and use, and need to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer-level image sensor module structure with specific focal length and manufacturing method thereof
  • Wafer-level image sensor module structure with specific focal length and manufacturing method thereof
  • Wafer-level image sensor module structure with specific focal length and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0056] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the structure of the wafer-level image sensor module with a specific focal length and its The specific implementation, method, steps, structure, features and effects of the manufacturing method are described in detail below.

[0057] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. Through the description of the specific implementation mode, a more in-depth and specific understanding of the technical means and effects adopted by the present invention to achieve the intended purpose can be obtained. However, the accompanying drawings are only for reference and description, and are not used to explain the present invention. be restricted.

[0058] FIG. 1 is a schematic struc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wafer-level image sensor module structure with a specific focal length and a manufacturing method thereof. The manufacturing method is to provide a silicon wafer including a plurality of image sensing chips with photosensitive regions, and provide a lens group wafer including a plurality of wafer-level lens groups with a specific focal length, and then use these image sensing Chips and wafer-level lens groups are graded and screened according to different qualities, and each wafer-level lens group is assigned to be set on each image sensing chip of the same level according to the quality graded and screened results, and each wafer-level lens is The group is aligned with the photosensitive area of ​​each image sensing chip, and finally packaged so that the packaging glue covers the surroundings of the wafer-level lens group.

Description

technical field [0001] The present invention relates to a manufacturing method and structure of an image sensor module, in particular to a wafer-level image sensor module structure with a specific focal length that is applied to reduce the height of the image sensor module and simplify the manufacturing process and its method of manufacture. Background technique [0002] A conventional camera module includes an image sensor, an IR filter, a lens, and a holder for holding these components. Among them, the image sensor is a semiconductor device used to capture images of objects, and can be applied to various electronic products such as digital cameras (DSC), digital video cameras (DV), security monitoring, mobile phones, and vehicle image sensor modules. However, in order to meet the needs of various electronic products that need to be thin, light and small, and can be mass-manufactured, it is necessary to effectively simplify the manufacturing process and reduce the size of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L27/146H04N5/225
Inventor 杜修文陈翰星辛宗宪陈明辉
Owner KINGPAK TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com