A kind of white light led packaging structure and packaging method

A technology of LED packaging and white light, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of uniform mixing of phosphor powder resin, affecting the light efficiency of LED devices, and affecting the uniformity of white light, so as to simplify the packaging process and improve Light efficiency and uniformity of white light, which is beneficial to the effect of device light efficiency and uniformity of white light

Inactive Publication Date: 2011-12-07
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

This packaging method is first of all complex in process and needs to go through processes such as stirring, defoaming, dispensing, and curing, but more importantly, it is difficult to mix the phosphor powder with the resin evenly. On the one hand, it affects the improvement of the light efficiency of the LED device, and on the other hand On the one hand, it affects the uniformity of white light

Method used

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  • A kind of white light led packaging structure and packaging method
  • A kind of white light led packaging structure and packaging method
  • A kind of white light led packaging structure and packaging method

Examples

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Embodiment 1

[0026] The white LED is mainly provided with a double-layer substrate with a bracket, a light-emitting chip 1, two connecting wires 2, and a colloid 11. The center of the surface of the white LED is surrounded by a bracket to form a bonding area 3, and a There is a positive electrode 6 and two negative electrodes 7, see figure 2 , the double-layer substrate is mainly provided with an insulating substrate 12 (wherein the insulating substrate 12 is a printed circuit board or a ceramic substrate), the top of the insulating substrate 12 is combined with a conductive layer, and the conductive layer is etched to obtain a conductive pattern 5, and a layer is coated on the top. The isolation glue 8 made of a layer of PU must reserve several parts when coating the isolation glue 8, such as the bonding area 3, the positive electrode 6 and the negative electrode 7 do not need to apply the isolation glue 8.

[0027] The light-emitting chip 1 is bonded to the bonding area 3 of the substra...

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PUM

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Abstract

The invention relates to a white light LED packaging structure and packaging method. The packaging structure includes a double-layer substrate; at least one light-emitting chip, and at least two connecting wires; the double-layer substrate includes an insulating substrate and a conductive pattern to form a bonded area and several electrode areas, the top of the double-layer substrate avoids the bonding area and several electrode areas and is coated with isolation glue; the double-layer substrate also has an insulating bracket and at least one fluorescent film for tiled on an insulating support; the bonding area is jointly formed by an insulating substrate, an insulating support and a conductive pattern. The invention adopts the fluorescent film to replace the traditional fluorescent powder, avoids the mixing of the fluorescent powder in the resin, and provides the possibility of further improving the light efficiency and white light uniformity of the white light LED.

Description

technical field [0001] The invention belongs to the field of LED package structures, and in particular relates to a white light LED package structure and a package method. Background technique [0002] Since the invention of white light LED, due to its long life, low energy consumption and environmental friendliness, it has shown the potential to replace traditional lighting methods, and is rapidly expanding from personal communication equipment, liquid crystal display backlight applications to automotive lighting and home lighting. general lighting field. [0003] The realization of white LED usually adopts the scheme of combining semiconductor chips with phosphors, namely (1) blue LED chips combined with yellow phosphors; (2) blue LED chips combined with green and red phosphors; and (3) ultraviolet LED chips combined Blue, green and red phosphors. It can be seen that photoluminescent materials (ie, fluorescent materials) and their packaging methods are one of the key tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/00H01L25/075
CPCH01L2224/48091H01L2224/48227
Inventor 王宏志谷鋆鑫李耀刚张青红
Owner DONGHUA UNIV
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