A kind of white light led packaging structure and packaging method

Abstract

The invention relates to a white light LED packaging structure and packaging method. The packaging structure includes a double-layer substrate; at least one light-emitting chip, and at least two connecting wires; the double-layer substrate includes an insulating substrate and a conductive pattern to form a bonded area and several electrode areas, the top of the double-layer substrate avoids the bonding area and several electrode areas and is coated with isolation glue; the double-layer substrate also has an insulating bracket and at least one fluorescent film for tiled on an insulating support; the bonding area is jointly formed by an insulating substrate, an insulating support and a conductive pattern. The invention adopts the fluorescent film to replace the traditional fluorescent powder, avoids the mixing of the fluorescent powder in the resin, and provides the possibility of further improving the light efficiency and white light uniformity of the white light LED.

Description

technical field [0001] The invention belongs to the field of LED package structures, and in particular relates to a white light LED package structure and a package method. Background technique [0002] Since the invention of white light LED, due to its long life, low energy consumption and environmental friendliness, it has shown the potential to replace traditional lighting methods, and is rapidly expanding from personal communication equipment, liquid crystal display backlight applications to automotive lighting and home lighting. general lighting field. [0003] The realization of white LED usually adopts the scheme of combining semiconductor chips with phosphors, namely (1) blue LED chips combined with yellow phosphors; (2) blue LED chips combined with green and red phosphors; and (3) ultraviolet LED chips combined Blue, green and red phosphors. It can be seen that photoluminescent materials (ie, fluorescent materials) and their packaging methods are one of the key tec...

AI Technical Summary

Problems solved by technology

This packaging method is first of all complex in process and needs to go through processes such as stirring, defoaming, dispensing, and curing, but more importantly, it is difficult to mix the phosphor powder with the resin evenly. On the one hand, it affects the improvement of the light efficiency of the LED device, and on the other hand On the one hand, it affects the uniformity of white light

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