Method and device for forming and assembling micro-scale parts

Abstract

The invention discloses a method and a device for forming and assembling a microscale part, and is applied to the forming and the assembly of micro-precision parts such as integrated circuits and microelectronic products. According to the method, flat top type strong pulse laser illuminates on a restraint layer to form pressure wave to impact a target and make the target locally and rapidly expanded; a micro-blanking material flying at a high speed is obtained under the action of a cutting mould; the micro-blanking material flies at a high speed and then hits against a part to be assembled, so the surface appearance of the part to be assembled is copied and microscale forming is formed; and the speed of the formed microscale part is reduced to zero, the formed microscale part is attached onto the upper surface of the part and then assembled, and the positioning and the installation of the microscale part are performed, so the integration of the forming and the assembly of the microscale part is realized. By the method, the forming and the assembly of the microscale part can be realized simultaneously; therefore, the method is a modern micro-device making method which integrates the processing and the assembly of the microscale part, and has the processing characteristics of high flexibility and high efficiency. Moreover, rapid industrialized production in a large scale is easyto realize.

Description

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AI Technical Summary

Benefits of technology

This technology allows for quick formation and assembly without damaging fragile components during the fabrication processes used for producing microsized devices like sensors that require precise placement on specific areas within their structure. By utilizing this technique, it becomes possible to produce large numbers of small precision products quickly with minimal effort compared to traditional methods such as machining tools.

Problems solved by technology

Technological Problem: Current Microsized Plasma Mold Compact Tool Assembly Method Using Sheet Metal Technology involves complex steps like deformation or removal from the tool's surfaces during demoldings due to weakening resistance caused by thin films made of materials called dielectrics. Additionally, current techniques involve expensive equipment costs and require large amounts of energy input. Therefore, this patented solution provides technical solutions aimed at improving these issues while reducing their impact on the overall economic benefit of producing small electronic components.

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