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Novolac resin and thermosetting resin composition

A technology of novolac resin and composition, which is applied in the field of novolak resin and thermosetting resin composition compounded with the above-mentioned novolac resin, which can solve the problems of high hydroxyl concentration and moisture resistance of molded products, and achieve excellent moisture resistance and The effect of heat resistance

Inactive Publication Date: 2011-12-14
AICA KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Although the fluidity of the resin obtained in this way is improved, the concentration of hydroxyl groups is still high, so there is still a problem with the moisture resistance of molded products

Method used

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  • Novolac resin and thermosetting resin composition
  • Novolac resin and thermosetting resin composition
  • Novolac resin and thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] 100 g of o-cresol, 56 g of salicylaldehyde, 1 g of boric acid, and 1 g of oxalic acid were added to a flask equipped with a cooling tube and a stirrer, and reacted at 100° C. for 8 hours.

[0105] Next, the catalyst was removed by washing twice with 100 g of pure water.

[0106] Next, the distillate was removed at 180° C. and a reduced pressure of 50 mmHg to obtain 102 g of novolac resin A.

[0107] Novolac resin A 1 The NMR picture is shown in figure 1 .

Embodiment 2

[0109] Except having used m-cresol 100g as a phenol, it reacted similarly to Example 1, and obtained 110g of novolac resin B.

Embodiment 3

[0111] Except having used 45 g of salicylaldehyde and 3 g of paraformaldehyde as aldehydes, it reacted similarly to Example 1, and obtained 105 g of novolac resin C.

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PUM

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Abstract

Disclosed are a modified novolac resin having excellent moisture resistance and heat resistance, and a thermosetting resin composition wherein the modified novolac resin is blended as a curing agent. Specifically disclosed is a novolac resin represented by formula (III), wherein the ratio of ortho-ortho-ortho bonds produced by condensing a hydrogen atom in the ortho position of a phenol represented by formula (II') and a phenol represented by formula (II'') with an aldehyde group of an orthohydroxybenzaldehyde is not less than 70% by mole of the total bonds. Also specifically disclosed is an epoxy resin composition containing the novolac resin.

Description

technical field [0001] The present invention relates to a novolak resin having good moisture resistance and heat resistance, and a thermosetting resin composition containing the novolac resin. Background technique [0002] Phenolic resins are heat resistant and can be used in various fields. [0003] For example, when used as a curing agent for epoxy resin, it has excellent heat resistance, adhesion, and electrical insulation, so it can be used in resin compositions for printed circuit boards and / or printed circuit boards and copper foils with resin attached. It is used in resin compositions for interlayer insulation materials, resin compositions for sealing materials of electronic components, resist inks, conductive pastes (containing conductive fillers), paints, adhesives, composite materials, etc. [0004] In addition, with technological innovations in recent years, improvements in moisture resistance, heat resistance, flame retardancy, and the like are also required for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/00C08G8/04C08G59/08C08G59/62
CPCC08G8/04C08G8/00C08G8/10C08L61/06
Inventor 泷本进一小野能理善
Owner AICA KOGYO CO LTD
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