A kind of polycrystalline silicic acid method texturing process

Abstract

The invention discloses a polycrystalline silicon acid texturing process, which comprises the following steps of: texturing with acid liquor, removing the acid liquor, removing an oxide layer and metal ions, cleaning and drying. By the process, the weight reduction of a silicon chip is unchangeable, the reflectivity is improved, the black line of the surface is controlled, and the capacity of equipment is improved.

Description

technical field [0001] The invention relates to the field of making solar cells, in particular to a polycrystalline silicic acid texturing process. Background technique [0002] In recent years, polycrystalline silicon solar cells have been more and more widely used due to their high conversion efficiency, stable performance and moderate cost, and their output has surpassed that of monocrystalline silicon, occupying a dominant position in the market. [0003] In order to improve the photoelectric conversion efficiency of solar cells, it is necessary to chemically treat the silicon wafer during production, so that the surface of the silicon is made into a suede surface with a certain shape. Due to the existence of the suede surface, the reflectivity of the surface of the object will be greatly reduced. , so as to increase the absorption of light. The texturing of polycrystalline silicon wafers is isotropic etching on the surface of silicon wafers through chemical reactions to...

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Problems solved by technology

[0003] In order to improve the photoelectric conversion efficiency of solar cells, it is necessary to chemically treat the silicon wafer during production, so that the surface of the silicon is made into a suede surface with a certain shape. Due to the existence of the suede surface, the reflectivity of the surface of the object will be greatly reduced. , so as to increase the absorption of light. The texturing of polycrystalline silicon wafers is isotropic etching on the surface of silicon wafers through chemical reactions to form dense pit-like surface structures, which increases the number of reflections of light on the surface of silicon wafers and minimizes the The reflectivity of light increases the wide absorption, increases the short-circuit current (Isc), and then improves the photoelectric conversion efficiency. Therefore, in the process of texturing, the proportion of the chemical solution has different effects on the weight loss control, the reflectivity, and the formation of black lines. However, the weight loss of the existing process is relatively low, the production speed of the equipment is relatively slow, the production capacity is relatively low, and the reflectivity is relatively high, and the black line is serious