Semiconductor refrigeration or heating module and manufacturing method thereof

Abstract

The invention discloses a semiconductor refrigeration or heating module and a manufacturing method thereof. In the invention, each N-type semiconductor and P-type semiconductor are arranged on the first insulating ceramic sheet and the second insulating ceramic sheet at intervals without contacting each other. Between, fix at least 1 conductive metal sheet on the first insulating ceramic sheet, fix at least 2 conductive metal sheets on the second insulating ceramic sheet, the conductive metal sheet fixed on the second insulating ceramic sheet is more than that fixed on the first insulating ceramic sheet There is one more conductive metal sheet on the ceramic sheet, and one N-type semiconductor and one P-type semiconductor are fixed on each conductive metal sheet on the first insulating ceramic sheet, and will be fixed on the same conductive metal sheet on the first insulating ceramic sheet The other ends of the N-type semiconductor and the P-type semiconductor on the chip are respectively fixed on different conductive metal sheets on the second insulating ceramic chip. The invention has the advantages of high refrigeration or heating efficiency, energy saving, simple structure, easy manufacture, stable work, long service life and the like.

Description

technical field [0001] The invention relates to a semiconductor refrigeration or heating module and a manufacturing method thereof, belonging to the technical field of semiconductor refrigeration or heating. Background technique [0002] The technology of using the characteristics of P-type semiconductors and N-type semiconductors to perform electricity cooling or heating has been widely used in the field of refrigeration or heating. At present, in the prior art, P-type semiconductors and N-type semiconductors are generally made as a semiconductor element for cooling or heating. A technical solution for semiconductor refrigeration or heating disclosed in the patent literature is to make a galvanic pair semiconductor refrigeration element composed of a P-type semiconductor and an N-type semiconductor into a cylindrical shape, and open a through hole in the middle of the cylinder. One end of the galvanic pair is arranged inside the through hole, and the other end of the galva...

AI Technical Summary

Problems solved by technology

This kind of P-type semiconductor and N-type semiconductor is made into one as a semiconductor element for cooling or heating, which mainly has the disadvantage of low power conversion efficiency during cooling or heating, and because the integrated P-type semiconductor and N-type The heat dissipation effect of the semiconductor is not good, so it is not suitable for high-power use, and the integrated P-type semiconductor and N-type semiconductor are easy to age during use, which further reduces the cooling or heating efficiency.

Therefore, the use effect of the existing cooling or heating semiconductor elements that adopt P-type semiconductors and N-type semiconductors to make one is still not ideal.

Images