A kind of plastic encapsulation mold and upper lead wire and lower lead wire therein

Abstract

The invention relates to a plastic packaging die and an upper lead strip and a lower lead strip therein. The plastic packaging die comprises the upper lead strip (1) and the lower lead strip (2) for sealing a tube pin (3) of a device in the plastic packaging process of the device; the upper surface of the lower lead strip is provided with a lead slot (20) for accommodating the tube pin; and the upper lead strip is provided with a strip protrusion (10) at the position relative to the lead slot in the lower lead strip, so that the protrusion seals the lead slot from the top and the upper lateral surface of the lead slot when the upper lead strip is pressed on the lower lead strip. The plastic packaging die has the advantages that: the upper and lower lead strips in the plastic packaging diehave opposite inserted structures, and the upper lead strip is provided with the protrusion part at the corresponding position of the tube pin and just pressed on the front side of the tube pin of the device during closing, so that a material is not leaked at the front side and the reverse side, and no residual plastic packaging material is left on the tube pin of the device. In addition, the precision requirement for the tube pin is low on selection of the lead frame, so that the manufacturing cost of the lead frame can be reduced.

Description

technical field [0001] The invention relates to integrated circuit packaging, more specifically, to a plastic sealing mold for packaging semiconductor or integrated circuit components. Background technique [0002] In the use of semiconductor and integrated circuit components, it is generally required that the residual amount of plastic encapsulant on the pins be as small as possible. If there is a lot of plastic sealant remaining on the pins and sides of the device, it will cause false soldering and poor contact. If there are severe plastic seal residues on the pins of the device, it needs to be removed by high-pressure water spraying and flushing, which will increase the manufacturing cost virtually, and the processing result is not ideal. [0003] Figure 1A and Figure 1B Shown is a structural schematic diagram of the upper lead bar 1 and the lower lead bar 2 in the prior art plastic packaging mold. in, Figure 1A is a schematic diagram of the closed state; Figure 1...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a method that can seal the device pins during the plastic sealing process in view of the high requirements for the cooperation between the plastic sealing mold and the lead frame in the prior art, and the defects that the pin beading or the plastic sealing compound residues are prone to occur. plastic mold

[0006] Another technical problem to be solved by the present invention is to provide a device that can seal the device during the plastic sealing process in view of the high requirements for the cooperation between the plastic sealing mold and the lead frame in the prior art, and the defects that the pin beading or the residual plastic sealing compound are prone to occur. Top and bottom leads in plastic mold for pins

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